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1 2009

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Microstructural and thermal analysis of Cu-Ni-Sn-Zn alloys by means of SEM and DSC techniques

Wnuk G., Zielińska M.

Archives of Materials Science and Engineering

2009

Vol. 40, nr 1

27-32

Purpose: The urgent need to find new, non toxic, high temperature solders caused the abundance of research on multicomponent systems, so as to find new materials that could substitute lead-containing solders. Design/methodology/approach: In the paper Cu-Ni-Sn-Zn alloys were studied by differential scanning calorymetry (DSC) in argon atmosphere using a heating rate of 10 Kmin-1 and a cooling rate of 15 Kmin-1. There were determined heat effects and start and finish temperature of phase transitions. Each sample was heated and cooled twice. At the second run, Zn concentration was smaller (as Zn is a volatile component). Findings: Zn influence on phase transformations was established. For the second run, when Zn activity is smaller, heats and temperature of transformations are higher. Research limitations/implications: These experimental results, combined with other thermodynamic properties of the studied alloy, enable phase diagram calculation in the frame of the COST action MP0602. Practical implications: Phase diagrams of the studied alloys allow finding appropriate solder materials. Originality/value: The paper presents an influence of zinc on temperature and heats of transformations in Cu-Ni-Sn-Zn alloys and the microstructure of these alloys.