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PL
W pracy przedstawiono wyniki badań technologii otrzymywania warstw ZnOx metodą impulsowego reaktywnego rozpylania magnetronowego. Badano charakterystyki elektryczne procesów reaktywnych podczas rozpylania targetu Zn w obecności mieszaniny argon + tlen, identyfikując mod rozpylania magnetronowego. Określono warunki technologiczne, przy których osadzone warstwy miały właściwości zbliżone do właściwości stechiometrycznego tlenku cynku. Morfologia przekroju powierzchni wytworzonych warstw wskazała na budowę matrycy/osnowy dielektrycznej z wtrąceniami metalicznymi przy małym poziomie mocy krążącej, gdy strukturę włóknistą/kolumnową miały warstwy otrzymane przy dużych wartościach mocy krążącej. Współczynnik załamania światła wytworzonych warstw był w zakresie 1,97 ÷ 1,98. Badania przedstawione w pracy pokazały, że parametry procesu osadzania miału duży wpływ na wartość współczynnika ekstynkcji światła.
EN
This paper provides the results of research investigation of pulsed reactive magnetron sputtering method for preparation of ZnOx thin films. For identification the magnetron sputtering mode, the electrical characteristics of the reactive processes during sputtering of Zn target in the mixed argon + oxygen atmosphere were investigated. Technological conditions at which deposited films had properties similar to stoichiometric zinc oxide were determined. The morphology of films crosssection indicate that the structure of dielectric matrix/wrap with metallic inclusions was obtained at a low level of circulating power, while coatings obtained at high circulating power values had fibrous/column structure. The refractive index of the prepared films was in the range of 1.97 to 1.98. Research presented in this work showed that the parameters of sputtering had an effect on the value of the extinction coefficient.
EN
The research on the influence of modulation frequency on the properties of films synthesized using a unique pulsed power supply combined with a standard unbalanced circular magnetron was conducted in the process of pulsed magnetron sputtering (PMS). It was shown that by using different levels of modulation, the composition of plasma (measured by optical emission spectroscopy, OES) as well as film growth rate and morphology (observed with scanning electron microscope, SEM), can be changed. The impact of modulation is related to the used materials and gases and can vary significantly. It was concluded that modulation frequency can greatly influence the synthesis of materials and can be used as an additional parameter in PMS. Specific relations between modulation frequency and synthesized material require further investigation.
EN
Magnetron sputtered nickel and nickel oxide films have been studied for various applications. We may find, among others, these films in electrochromic display devices, in resistive type gas sensors, as metal electrodes in electronic devices, in solar thermal absorbers. Pure nickel films deposited using PVD technique possess good corrosion and wear resistant properties. Magnetron sputtering has several advantages in film deposition (in comparison to other methods) such as relatively low heating temperature of the deposited substrate during sputtering process, high energy of sputtered atoms (about 10 eV) at the substrate, which influences positively the films adhesion. From application point of view, the most valuable feature of these films is the possibility of scaling target dimensions, which makes feasible the deposition on a several square meter surfaces. The improvement of magnetron sputtering devices design may influence positively the optimization of the deposition technology and its efficiency. The thin nickel and nickel oxide films were prepared by pulsed magnetron sputtering using original type WMK magnetron device. Ni (99.9 %) has been used as a sputtering target of 100 mm in diameter and different thicknesses (3 mm, 5 mm, and 6 mm). The distance between the substrate and target was the same in all experiments and equal to 120 mm. Argon and oxygen gases were introduced during the reactive process through needle gas valves at a total pressure of 0.4 Pa. The sputtering power, sputtering pressure and oxygen partial pressure have been used as technological knobs for deposition processes. The helpful tool for controlling the pulsed magnetron sputtering process was the original parameter of supply (so called circulating power). Results from our experiments showed that the deposition of Ni films is possible even from targets of 6 mm thickness. Deposition rate increased proportionally with the sputtering power. The aim of this work is to use the acquired expertise to develop an efficient technology of thin nickel oxide layers for electrochromic systems.
EN
The resonant type power supplies of medium frequency designed for magnetron sputtering processes often use pulse density modulation to regulate the average discharge power level. While the output power level changes then number of pulses in a group changes, but the discharge current pulses are the same from pulse to pulse: their parameters (duration time, amplitude) do not change with the discharge power. The goal of this paper is to present the influence of medium frequency discharge power level on the direct current I-V characteristics of a single Langmuir probe and resulting plasma parameters caused by the pulse density modulation. The sputtering processes of titanium and copper were diagnosed at two spatial positions. The measured Langmuir probe I-V characteristics showed strong dependence on the discharge power. As the discharge powering pulses stay the same with the discharge power level change, such influence was unlikely to occur. Using time-resolved analysis of probe current waveforms the origin of this influence was indicated. The influence of discharge power level on the single probe Langmuir I-V characteristics and resulting plasma parameters was eliminated using a simple method of scaling the results. Finally, the reliable plasma parameters were calculated.
PL
Celem niniejszej pracy było otrzymanie warstw krzemku magnezu (Mg2Si) metodą impulsowego rozpylania magnetronowego. W pierwszym etapie opracowywanej technologii otrzymano proszek krzemku magnezu poprzez zastosowanie samorozwijającej się syntezy wysokotemperaturowej SHS (ang. Self-Propagating High-Temperature Synthesis). Z uzyskanego proszku, metodą spiekania na gorąco zostały wytworzone gęste spieki przydatne do produkcji targetów. Syntezę warstw Mg2Si prowadzono w aparaturze próżniowej NP - 501A produkcji TEPRO Koszalin. W cylindrycznej komorze próżniowej zainstalowano planarną wyrzutnię magnetronową współpracującą z zasilaczem Dora Power System (DPS). Zasilacz DPS przystosowany jest do zasilania urządzeń rozpylających, generując impulsy z częstotliwością 80 kHz, co pozwala określić stosowaną technikę magnetronową jako impulsową (ang. Pulsed Magnetron Sputtering). Otrzymane warstwy analizowano pod kątem składu chemicznego, fazowego i struktury przy użyciu niskokątowej dyfraktometrii rentgenowskiej (ang. Grazing Incidence Diffraction – GID), oraz mikroskopii skaningowej.
EN
The objective of this study was to deposit stoichiometric layers of magnesium silicide (Mg2Si) by pulsed magnetron sputtering. Magnesium silicide powder obtained by Self-Propagating High-Temperature Synthesis was hot pressed (HP) and the obtained dense sinter was suitable for the production targets. Mg2Si layers were deposited in a vacuum chamber (NP – 501A TEPRO Koszalin) equipped with one magnetron with a planar target, 50 mm in diameter. A pulsed power supply, Dora Power System, was used in the sputtering process. The power supply was generating sinusoidal pulses with a frequency of 80 kHz and group modulation of 2.5 kHz. Because of the type of the power supply, the method is referred to as Pulsed Magnetron Sputtering. The obtained layers were characterised by X-ray diffraction (GID), scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS).
PL
Artykuł podejmuje tematykę budowy systemu pomiarowego do dynamicznej spektroskopii optycznego widma emisyjnego plazmy (ang. Time-Resolved Optical Emission Spectroscopy - TR-OES). Przedstawione rozwiązanie projektowano pod kątem zastosowania tego układu do diagnostyki plazmy wyładowania jarzeniowego wytwarzanego przez magnetronowy układ rozpylający zasilany impulsowo. W artykule omówiono zasadę działania, nakreślono podstawy konstrukcji oraz przedstawiono przykładowe wyniki zarejestrowane przy użyciu zaproponowanego rozwiązania.
EN
The article discusses the construction of measurement system for Time Resolved Optical Emission Spectroscopy (TR-OES). The described solution was designed in terms of its application for diagnostics of glow discharge plasma in a pulsed magnetron sputtering deposition system. This article discusses the principle of operation, outlines the basis of the electronic circuitry design, shows sample results obtained using the proposed solution.
EN
Purpose: Hard nanocomposite nc-TiN/a-SiN films exhibit very attractive mechanical, tribological, optical and electronic properties related to their microstructure and chemical bonding. Design/methodology/approach: In the present work, we investigate ternary thin film TiSiN systems deposited by plasma assisted reactive pulsed magnetron sputtering (PARPMS) from titanium and silicon targets. PARPMS allows one to effectively control ion bombardment by reactive species (e.g., N2 +, N+) on the surface of the growing film by varying the bias voltage (VB) induced by a radiofrequency (RF) power applied to the substrate. Findings: RF biasing without additional heating of the substrate promotes formation of crystals within the nc films. Specifically, (111) crystal orientation at low VB (- 50 V) changed into (200) when VB was increased above - 600 V. At the same time, hardness (H) and reduced Young’s modulus (Er) of the films changed from H ~ 10 GPa and Er ~ 135 GPa to their maximum values of H ~ 25 GPa and Er ~ 248 GPa at VB = - 600 V. For comparison, for films deposited at 300şC and VB = - 200 V, the maximum values of H and Er of ~ 35 GPa and ~ 350 GPa were observed. Practical implications: The use of the PARPMS to effectively control the mechanical properties and microstructure of transition metal nitride systems films. Originality/value: Discussion of evolution of the film microstructure (crystal size and orientation) at constant film composition and relate it with the energetic aspects of the film growth and film characteristics.
PL
Badano proces osadzania cienkich warstw tlenku indowo-cynowego (ITO) na podłoża szklane metodą reaktywnego, impulsowego rozpylania magnetronowego targetu ITO (90% In₂O₃, 10% SnO₂) w temperaturze pokojowej. W celu poprawienia elektrycznych i optycznych właściwości napylonych warstw po procesie rozpylania wygrzewano je w próżni. Wygrzane warstwy charakteryzowały się niską rezystywnością około 10⁻⁴ Ω oraz wysoką transmisją światła w zakresie widzialnym, sięgającą 85%.
EN
Results of the room temperature deposition of indium-tin (ITO) layers from In₂O₃ : SnO₂ target (10% SnO₂) by pulsed magnetron sputtering are presented. ITO thin layers were deposited on the glass substrates. Sputtering process was performed in pure Ar and Ar + O₂ mixture. Post deposition vacuum annealing of ITO thin films caused meaning­ful decrease of their resistivity. The transparency of obtained layers was greater than 85% in visible spectrum.
PL
Warstwy aluminium domieszkowane gazem reaktywnym (azot, tlen) otrzymywano w procesie reaktywnego impulsowego rozpylania magnetronowego. Mod pracy magnetronu (stan powierzchni targetu) określano na podstawie zależności szybkości nanoszenia i mocy zasilania w funkcji ciśnienia parcjalnego gazu reaktywnego. Maksymalna szybkość nanoszenia przeźroczystych i twardych warstw (AlNx, AlxOy) wynosiła odpowiednio ~60 i ~ 100 nm/ min, przy mocy wydzielanej w katodzie magnetronu 75 W/cm² (odległość target-podłoże dS-T = 100 mm).
EN
Aluminium films doped with reactive gas (nitrogen, oxygen) were obtained during pulsed magnetron sputtering. Magnetron mode (surface condition of the target) was estimated from the parameters of the power supply unit and from the thin film deposition rates versus reactive gas partial pressure. The maximum deposition rate of transparent and hard films (AlNx, AlxOy) was ~ 60 and ~ 100 nm/ min respectively, at the target power density 75 W/cm² (target-substrate distance dS-T = 100 mm). The thin films were sputtered in metallic sputtering mode.
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