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Reagents Activity in a Copper Droplets / Post-Processing Slag Suspension

Wołczyński W., Karwan-Baczewska J., Najman K., Bydałek A. W.

Archives of Foundry Engineering

2016

Vol. 16, iss. 3

147--150

The suspension of the copper droplets in the post-processing slag taken directly from the KGHM-Polska Miedź S.A. Factory (from the direct-to-blister technology as performed in the flash furnace) was subjected to the special treatment with the use of the one of the typical industrial reagent and with the complex reagent newly patented by the authors. This treatment was performed in the BOLMET S.A. Company in the semi-industrial conditions. The result of the CaCO3, and Na2CO3 chemicals influence on the coagulation and subsequent sedimentation of copper droplets on the crucible bottom were subjected to comparison with the sedimentation forced by the mentioned complex reagent. The industrial chemicals promoted the agglomeration of copper droplets but the coagulation was arrested / blocked by the formation of the lead envelope. Therefore, buoyancy force forced the motion of the partially coagulated copper droplets towards the liquid slag surface rather than sedimentation on the crucible bottom. On the other hand, the complex reagent was able to influence the mechanical equilibrium between copper droplets and some particles of the liquid slag as well as improve the slag viscosity. Finally, the copper droplets coagulated successfully and generally, were subjected to a settlement on the crucible bottom as desired / requested.