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EN
Optical lithography or photolithography is well-established optical tool for patterning of substrates, layers or photonic crystals. Therefore, the materials involved in these processes play an important role, especially for the possibility of their further advancements and optimisation. In this review article, we discuss on the role and significance of photoresist materials from various perspectives like their performance in photonic applications and their dependence on various physical and chemical parameters. Further, several emerging now two-dimensional materials like graphene has also been discussed from photonic point of view. We aim to give a short overview of recent developments of such materials in this field.
PL
Fotolitografia jest dobrze znanym procesem pozwalającym na tworzenie wzorów na podłożach, warstwach czy kryształach fotonicznych. W związku z tym materiały wykorzystywane w tym procesie pełnią istotną rolę, zwłaszcza ze względu na dalszy możliwy rozwój dziedziny oraz optymalizację procesu. W tym artykule przeglądowym omawiamy rolę i znaczenie fotorezystu z różnych perspektyw, np. jego wydajność w zastosowaniach fotonicznych czy zależność od różnych parametrów fizycznych i chemicznych. Ponadto, omawiamy wiele powstających obecnie dwuwymiarowych materiałów, jak grafen, z punktu widzenia fotoniki. Naszym celem jest przedstawienie krótkiego przeglądu ostatnich osiągnięć w dziedzinie tego typu materiałów wykorzystywanych w fotolitografii.
2
Content available remote Holographic imaging with a nanometer resolution using compact table-top EUV laser
EN
Holographic 2D/3D imaging with nanometer resolution using short wavelength extreme ultraviolet (EUV) light is presented in this paper. Gabor's holograms were recorded with a highly coherent table top EUV laser with different numerical apertures demonstrating ultimately a spatial resolution of 46+/-2 nm, comparable with the illumination wavelength, in 2D holographic imaging. Three dimensional images were obtained from a single high numerical aperture hologram recorded in a high resolution photoresist and numerically reconstructed at different image planes, allowing numerical optical sectioning with a lateral resolution ∼170 nm and depth resolution of 2.4 μm. The holograms were recorded in a high resolution photoresist and digitized with an atomic force microscope. To assess the spatial resolution of the numerical reconstructions of the holograms a correlation method was used. The algorithm allows for simultaneous estimation of the resolution and the feature size of the image under analysis.
3
Content available remote Laser Direct Imaging system for high density interconnects on PCB
EN
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. This article shows an alternative method for creating electric circuit patterns on PCB in high density interconnects technology. In this article a prototype system for laser direct imaging as well as results of imaging examples are presented.
PL
Nowoczesne urządzenia elektroniczne są budowane z coraz mniejszych i sprawniejszych układów elektronicznych. W niniejszym artykule przedstawiono laboratoryjne urządzenie do bezpośredniego naświetlania ścieżek elektrycznych na PCB pokrytym fotopolimerem wykorzystując w tym celu technologię LDI (Laser Direct Imaging). W niniejszym artykule przedstawiono prototyp urządzenia do bezpośredniego naświetlania laserowego jak również przykładowe wyniki naświetlania ścieżek na płytkach drukowanych.
4
Content available remote Nanopatterning in a compact setup using table top extreme ultraviolet lasers
EN
The recent development of table top extreme ultraviolet (EUV) lasers have enabled new applications that so far were restricted to the use of large facilities. These compact sources bring now to the laboratory environment the capabilities that will allow a broader application of techniques related to nanotechnology and nanofabrication. In this paper we review the advances in the utilization of EUV lasers in nanopatterning. In particular we show results of the nanopatterning using a table-top capillary discharge laser producing 0.12-mJ laser pulses with 1.2-ns time duration at a wavelength λ = 46.9 nm. The nanopatterning was realized by interferometric lithography using a Lloyd's mirror interferometer. Two standard photoresists were used in this work, polymethyl methacrylate (PMMA) and hydrogen silsesquioxane (HSQ). Pillars with a full width half maximum (FWHM) diameter of 60 nm and holes with FWHM diameter of 130 nm were obtained over areas in excess of 500x500 µm².
5
Content available remote Laser direct imaging of tracks on PCR covered with laser photoresist
EN
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 [mi]m or 25/25 [mi]m technology are real. Existing technologies are unable to offer acceptable solution. Recently the laser direct imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a phototool or mask. Our laboratory system for LDI is designed for tracks and spaces on PCB with minimum width distance of 50/50 [mi]m. In comparison with conventional photolithography method, this technology is much better for 50/50 [mi]m track and spaces. In our research we used photoresist with resolution 50 [mi]m, but in case of using laser photoresists with better resolution (e.g. 25 [mi]m) it will be possible to image tracks in super-fine-line technology (25/25 [mi]m). The comparison between two technology of creating mosaic pattern tracks on PCB proved that laser imaging is promising technology in high density interconnects patterns, which are widely use in multilayered PCB and similar applications.
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