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Solving RFIC Simulation Tasks Using GPU Computations

Andrei M. I., Kula S.

Computational Methods in Science and Technology

2013

Vol. 19, No. 2

89--97

New generation of General Purpose Graphic Processing Unit (GPGPU) cards with their large computation power allow to approach difficult tasks from Radio Frequency Integrated Circuits (RFICs) modeling area. Using different electromagnetic modeling methods, the Finite Element Method (FEM) and the Finite Integration Technique (FIT), to model Radio Frequency Integrated Circuit (RFIC) devices, large linear equations systems have to be solved. This paper presents the benefits of using Graphic Processing Unit (GPU) computations for solving such systems which are characterized by sparse complex matrices. CUSP is a GPU generic parallel algorithms library for sparse linear algebra and graph computations based on Compute Unified Device Architecture (CUDA). The code is calling iterative methods available in CUSP in order to solve those complex linear equation systems. The tests were performed on various Central Processing Units (CPU) and GPU hardware configurations. The results of these tests show that using GPU computations for solving the linear equations systems, the electromagnetic modeling process of RFIC devices can be accelerated and at the same time a high level of computation accuracy is maintained. Tests were carried out on matrices obtained for an integrated inductor designed for RFICs, and for Micro Stripe (MS) designed for Photonics Integrated Circuit (PIC).

Interconnect elements propagation quantities in PIC

Kula S.

Poznan University of Technology Academic Journals. Electrical Engineering

2012

No. 70

83--89

This paper describes methods to extract nominal values of propagation quantities for thin-film, straight interconnect elements. The propagation quantities like effective dielectric permittivity ɛeff, attenuation α, characteristic impedance Zo are calculated with the use of analytical and approximated formulas. These expressions are obtained by transforming and by fitting formulas, typically used for calculation of per unit length transmission line parameters. Methods are verified for typical thin-film interconnect elements dimensions and for typical materials used in the Photonics Integrated Circuits (PIC). The novelty of the study is the parametrization with respect to the geometrical dimensions. The parametrization is based on the approximation expressions in the form of rational polynomials obtained by fitting.