Wyniki wyszukiwania - BazTech

1

Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process

Rahman Ahmad R. A., Nayan Nazrul Anuar

Advances in Science and Technology. Research Journal

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2020

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Vol. 14, no 3

57--64

EN

The demand for small, thin, and lightweight electronic devices is increasing. More advanced design and assembly processes of electronic packaging technology have developed to fulfill this need. The critical processes in semiconductor packaging involved in meeting the ever increasing demands of technology include wafer back grinding, dicing, and die attachment. With low die thickness, the risk of die failure, which can cause functional damage, is high. In the die attachment process, the pin ejector causes an impact during the pick and place process. Those effects can result in a micro indentation or micro crack under the die and would be the weak point throughout the entire process. This study designed and evaluated an ejector system for the die attachment process. The proposed method uses a static pole heated inside the cavity for the platform to die before being ejected. Vacuum stabilizes the die suction. Moreover, heat softens the sawing tape and weakens the die adhesion. For die selection during the die attachment process, the results show that the critical die crack problem for a thin and rectangular die is solved using the proposed method. In summary, the packaging of semiconductors has advanced to accommodate the pick-up technology solution in relation to the challenging material needed for the current miniaturization market trend and demand.

2

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Seigneur F., Maeder T., Jacot J.

Electron Technology : Internet Journal

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2005/2006

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Vol. 37/38, nr 8

1-5

EN

Packaging is the las step of the manufacturing processes of microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the two parts of the package using a laser diode. The advantage of the laser soldered joint are its hermeticity to water and air in regard to glue and plastics, as well as the possibility to heat only the soldered joint, without affecting its contents. This work presents results of this packaging process, together with a method used to measure the hermeticity based on the oxidation of a heated metal conductor such as tungsten. The resistance of the conductor, which is encapsulated inside the package, increases as oxygen and water diffuse through the seal, which provides a convenient semi-quantitative measurement.

3

Materiały podłożowe i metody wykonywania połączeń struktura - podłoże obudowy. Część 2

Krzesaj-Janyszek B.

Elektronika : konstrukcje, technologie, zastosowania

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1998

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Vol. 39, nr 10

10-15

PL

Połączenie struktury czujnika z podłożem obudowy stanowi pierwszy etap technologii montażu. Podstawową zasadą przy montażu struktur krzemowych jest to, aby właściwości materiałów użytych do montażu były takie same lub zbliżone do parametrów krzemu i warstw naniesionych na strukturze. W artykule opisano wiele typów podłoży, materiałów, z których są one wykonane, technologię wytwarzania podłoży oraz metody łączenia struktur czujników z podłożami.

EN

Bonding between chip and substrates of package is the firs step of packaging process. The basic principle of packaging is: proprieties of all materials used in assembling process' must be similar to silicon as close as it is possible. These are a lot of materials for substrates and the suitable methods of connecting chip with substrate. In this paper the development of methods of producing substrates and bonding techniques between substrates and chips is received.