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Optimization of sealing parameters of double-sealing pipeline repair clamp

Zhao Bingjie, Zhang Shuli, Gao Qijun, Miao Canliang, Wang Tongyu

Journal of Theoretical and Applied Mechanics

2022

Vol. 60 nr 3

333--346

Considering the key equipment of the pipeline clamp repair technology, this paper analyzes design of the pipeline repair clamp. Based on the damaged pipeline repair requirements, the design of a double-sealing pipeline repair clamp is established. The subsea pipeline in the Bohai Bay is considered as an example to develop a finite element model of a double sealing structure and calculate the sealing capacity, targeting a sealing pressure of 6MPa. The parameters affecting the sealing capacity are studied. For circumferential sealing, the effects of distance between the rubber and the pipeline, distance between the ring and the pipeline, and the contact friction coefficient on the sealing capacity are analyzed. The design parameters of circumferential sealing are optimized by an orthogonal experimental design method. Further, the effect of the friction coefficient on the axial sealing capacity is studied, and design suggestions are put forward based on the analysis. The results of this study can provide guidance for the design and application of subsea pipeline repair clamps.

Electromigration failure prediction and reliability evaluation of solder bumps for FCBGA package

Zhang Y.

Engineering Transactions

2015

Vol. 63, iss. 2

215--232

Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper. The driving forces in electromigration include electron wind force, stress gradient, temperature gradient as well as atomic density gradient. The electromigration simulation is performed on flip chip ball grid array (FCBGA) package based on ADI method, and the simulation results for void generation and time to failure (TTF) have a reasonably good correlation with the testing results. Orthogonal experimental design has been used to evaluate the effect of design parameters on TTF of electromigration. Based on this study, some practical recommendations are made to optimize the package design and improve the solder bump electromigration reliability.