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EN
The ongoing trend of miniaturization of electronic devices, including computer processors, high-speed servers and micro-electromechanical system devices, should go hand in hand with their improved performance. However, managing heat remains a major challenge for these devices. In the present study, a numerical investigation was done on a micro-channel heat sink with an openstepped micro-pin fin heat sink with various arrangements through ANSYS software. Pin fin was varied in a fashion of increasing and decreasing. The working fluid opted for was water in a single phase. The analysis takes into account varying thermo-physical properties of water. The operating parameters, i.e. the Reynolds number was taken as 100–350 and heat flux as 500 kW/m2 . Arrangements selected were staggered and inline. Observationsrevealed that the staggered 2 arrangement has shown better thermal performance than other arrangements within the entire investigated range of Reynolds numbers because of the effective mixing of fluids. Furthermore, the inline configuration of micro pin fin heat sink has the worst performance. It is interesting to note that a very small difference was observed in the heat transfer capability of both staggered configurations, while the pressure drop in the staggered 2 arrangement has shown an elevated value at a higher Reynold number value compared to the staggered 1 arrangement.
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