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1
Content available Surface treatment for improvement of coefficient of friction on sliding surfaces
Tanabe I., Soe Y. H., Iyama T.
Journal of Machine Engineering
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2012
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Vol. 12, No. 1
7--17
EN
Recently, many micro structure products are used for compact, high precision and others functions in the field of measuring instruments, medical instruments, information processing devices and so on. However, in the small sliding parts of these products, the surface contact pressure becomes lowered and then, higher adhesive force occurs, resulting larger coefficient of friction. On the other hand, in the field of machine tools, lubrication free sliding parts are also demanded for eco-friendly. In this study, the surface treatment for improvement of coefficient of friction for both light load and heavy load applications are investigated. When laser ray is applied on stainless steel surface, CrO2 layer with small concaves like dimple is generated. This CrO2 layer is used in light load applications. Next, TiAlN and DLC coating are being used on cutting tools for reducing coefficient of friction and cutting heat. Therefore, these coating materials are used for heavy load and oil free applications. The improvement of coefficient of friction and life of coating are investigated by experiments. It was concluded from the results that; (1) Coefficient of friction for light load application can be reduced by coating CrO2 layer. (2) Coefficients of friction for heavy load application were reduced by coating TiAlN and DLC layer. (3) Life of both CrO2 and DLC layers are sufficiently long for practical applications at light load and heavy load respectively.
2
Content available Grinding and finishing sculptured surfaces using an innovative multitool head with independent pneumatic drive
Baran J., Plichta J.
Journal of Machine Engineering
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2012
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Vol. 12, No. 4
7--14
EN
The paper presents the concept and prototypes of multitool grinding and polishing head with independent pneumatic drive for grinding and finishing large free form surfaces (FFS). Such a head facilitates selection of elastic abrasive discs, grinding process parameters and conditions, as well as proper shaping of the marks of the workpiece surface geometric structure.
3
Mechatronic aspects of wired in-pipe passive smart bristle micromachine design
Dovica M., Gorzás M., Katuch P., Kováč J., Ondočko S.
Elektronika : konstrukcje, technologie, zastosowania
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2004
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Vol. 45, nr 8-9
167-169
EN
In this paper we describe design and modelling of the wired in-pipe micromachine which is able to self motion in pipe with inner diameter 35 mm. Micromachine is used tor inspection of inner surface defects Motion principle is based on transformation of the rotary to the linear motion by the worm gearing and the crank mechanism. The mathematical and graphical model of passive smart bristle and experiments of simulation we have analysed. Control system design respects of the continuous movement requirements in case of loading conditions.
PL
W artykule opisano konstrukcję oraz modelowanie instalowanej wewnątrz rury mikromaszyny, która potrafi sama poruszać się w rurach o wewnętrznej średnicy 35 mm. Mikromaszyna wykorzystywana jest do wykrywania i badania uszkodzeń wewnętrznej powierzchni rury. Zasada poruszania się bazuje na zamianie ruchu obrotowego na liniowy za pomocą przekładni ślimakowej oraz mechanizmu korbowego. Przeanalizowano matematyczny i graficzny model biernej inteligentnej wypustki oraz rezultaty badań symulacyjnych. Struktura systemu sterowania uwzględnia wymagania ruchu ciągłego w przypadku występowania obciążenia.
4
Content available remote The microfactory in Japanese national R&D project
Ataka T., Furuta Kazuyoshi.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
26-32
EN
We have been developing an experimental microfactory system in R&D project of Industrial Science and Technology Frontier (/.OF) of M1TI. The aims of this project are to investigate technological possibility of "microfactory" and to make clear the problems to be solved in realizing it. The microfactory system consists of three units; processing, assembling and conveyance unit, in the same way as present manufacturing system. The system will be about the size of a desktop and can handle small parts several grams in weight. Two different ways to reduce the size of the system have been pursued and the system will be achieved in 2000.
5
Content available remote Multiple distributed micromachine system
Namura K.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
33-41
EN
Using micromachine technology, we have developed the second prototype of a mul-nple distributed micromachine system. The developed micromachine is the world's smallest machine (width: 9 mm, length: 5 mm, height: 6.5 mm, weight: 0.52 g) that can travel in both the horizontal and vertical directions. This paper gives an overview of the prototype and its travel and connection/disconnection performance. The following conclusions were obtained: (1) The developed micromachine is able to travel freely on a horizontal plane. (2) Ten connected micromachines can move vertically around a small tube. (3) Automatic connection and disconnection are realized by newly developed microconnectors.
6
Content available remote Modelling simulation and design of micromechanical devices in ITE
Łysko J.M.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
84-91
EN
R&D activity of the ITE Sensors Department is presented. Several types of the piezoresistive-type pressure sensors are already produced in the small scale and offered to the customers on the local market. Silicon structures' designs, housings and technology are still optimized to improve functional parameters of the devices. Other sensors are under research. Technological experiments and production are realized in cooperation with the ITE Technological Department. PSFET (Pressure Sensitive Field Effect Transistor) and DPR (Dew Point Detector) are both developed in cooperation with the Warsaw University of Technology. Capacitive and piezoresistive type acceleration sensors are the subject of the ITE individual research program, sponsored from the government founds. ISE (Ion Selective Electrodes) and m-TAS (Micro Total Analysis System) are the newly opened programs in the chemical sensor area.
7
Content available remote Micromachined silicon sensors
Iwaoka H.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
49-60
EN
This paper reviews novel silicon micromachining technology and sensors developed in Yokogawa Electric Corporation. Two types of pressure sensors are described: a highly stable and accurate resonant sensor fabricated using special vacuum encapsulation technology: and an integrated pressure sensor with twin diaphragms and micro over-range protection structures. Also described are silicon bolometers and micro variable infrared filters for infrared spectroscopy of gas analyses and silicon mi-croforce sensors.
8
Content available remote Medical applications of micromachines
Ota R.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
20-25
EN
In the medical field, there are great needs for sophisticated and less-invasive procedures. If we can realize the inspection and treatment devices much smaller by the micromachine technology, it would produce significant benefits for society as a whole in the form of saved lives, shorter hospital stays, and the prevention of complication. We are committed to the development of micromachine technologies to meet these requirements. As an example, we are developing the elemental technology for realizing a diagnostic and therapeutic microcatheter for cerebral blood vessel. We will present micro-tactile sensors for transmitting tactile information from the inner wall of the tubing or body cavity to the catheter to ensure safe and positive guidance. And we will also present the other technologies which constitute the microcatheter.
9
Content available remote Integrated instruments for total chemical analysis
Dziuban J.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
70-71
EN
Previous works on silicon micromachined devices started in the Institute of Microsystems Technology (ITM) of the Wroclaw University of TEchnology (WUT) in late 80's, although some fundamental technological works on silicon anisotropic etching for three-dimensional structures fabrication were done in mid 70's. Our Institute was the first in Poland recognising a need of micromachined sensors and actuators investigations. In the lecture some of the most interesting past works will be shown. Newly developed components for analytical chemistry and microchemistry will be presented. a short sketch of recently discovered fast deep anistropic etching of single silicon wafers and other materials will be presented. Samples of devices and short TV movie on our works will be shown.
10
Content available remote In-pipe wireless inspection micromachine
Kawahara N.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
42-48
EN
We have been developing an In-Pipe Inspection Micromachine for inspection on the inner surface of thennoconduction tubes of power plants, in the Collaboration with DENSO, Toshiba and SANYO under the project. The machine consists of several devices, CCD camera for inspection, actuator for locomotion, communication circuit for control, microwave antenna and photovoltaic device for energy supply and communication, and so forth. Through the project, the technologies of the component devices and the system have been developed. Several prominent results were also obtained on the both technologies. As for the device technologies, the component devices have been miniaturized and integrated. As for the systematization technologies, the functions, simulation, packaging and assembling of the system have been studied.
11
Content available remote Future prospects of micromachines
Hirano T.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
9-19
EN
Micromachine is expected to be a Japanese industrial base in the 21 st. century. The reason is it would create a new technological paradigm, which presents solutions to current human problems and, at the same time, presents fresh opportunities for a new human life and also new industries.
12
Content available remote Detectors of UV and infrared radiation obtained using silicon micromachining
Dobrzański L.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
69-69
EN
Technology of the surface silicon micromachining developed in ITME compnses fabrication of a porous silicon as a sacrificial layer. This is need to suspend device over a cavity and thermally isolate sensing element from the heat sink. Two types of devices have been fabricated and characterised a: bolometer and a termopile.
13
Content available remote Applications of deep x-ray lithography
Hirata Y.
Materiały Elektroniczne
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2001
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T. 29, nr 1-2
61-68
EN
We developed the LIGA process using a compact synchrotron radiation (SR) source and ceramics micro fabrication process. These processes realized an array of lead zir-conate titanate (PZ7) rods whose cross section is 25 urn and was applied to manufacture piezocomposite for high resolution ultrasonic diagnosis for the first time. We also developed microconnector by the LIGA process.
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