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Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

Felba J., Fałat T., Wymysłowski A.

Materials Science Poland

2007

Vol. 25, No. 1

45--55

Thermally conductive adhesives are among major concerns of contemporary microelectronics. The main goal of ongoing research is to improve the thermal conductivity of these composites by using a proper filler material and the best shape and size of filler particles. In this work, it has been proven by numerical simulation that the polymer matrix may also play a crucial role, as the contact area between filler particles depends on the stresses that occur due to the shrinkage of the resin during curing. It has been observed that the resins relax with time. The time until the fully relaxed state is reached strongly depends on the temperature at which the system operates. In the considered case, the contact pressure is fully relaxed when it decreases from the initial value of 0.73 GPa to 0.03 GPa. When the temperature is 70°C, the contact pressure becomes fully relaxed after 10 seconds, but when it is lower than 40°C, the relaxation is completed after about 109 seconds (more than 30 years!). After the relaxation of contact pressure the thermal conductivity drops by approximately 50% of the initial thermal conductivity of the non-relaxed structure.

Molecular modeling as a novel and promising numerical tool in microelectronics packaging

Matkowski P., Wymysłowski A., Felba J.

Electron Technology : Internet Journal

2005/2006

Vol.37/38, nr 14

1-6

Numerical modeling is a widespread tool in microelectronics, which is used generally for support of the prototyping stage. One of the novel numerical tools that are currently emerging is technique based on molecular modeling. Molecular modeling is well known and utilized method in chemistry, biology, medicine, biotechnology, pharmacy and physics. Scientists and researchers have been using molecular modeling to simulate reactions at the molecular levels for many years. Additionally molecular modeling is used in e.g. material modeling. Scientists are interested in material modeling and simulations because of complexity of novel materials. Many novel materials include fillers or particular structure that ensures its mechanical or electrical properties. Molecular modeling and simulations enables to control structure and properties of the materials in the nano-scale. By conducting molecular modeling researchers can obtain proposals of materials that vary in properties by low costs. Molecular modeling also ensures control of processes and prediction possibility. The current paper is focused on possible areas of application of molecular modeling in microelectronic packaging. The paper describes the current state-of-the-art and benefits of molecular modeling to selected problems common in microelectronic packages. Our goal in the future is to apply molecular modeling, as a support tool, to resolve problems that occur in microelectronic packaging as e.g. problem of surface phenomena, thin films, viscoelasticity or mechanical and thermal properties of novel materials and compounds.