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Methodic of obtaining Ni/Cu metal multilayers by electrochemical deposition.

Wykpis K., Budniok A.

Archives of Materials Science

2006

Vol. 27, nr 2-3

129-137

Ni/Cu multilayers have been obtained by electrodeposition method from a single bath realized by cyclic changes of deposition current densities of Ni and Cu sublayers. In order to determine the current conditions of Ni/Cu multilayer deposition, the potentiodynamic characteristics of the course of processes present during nickel and copper deposition were determined. The character of the potential changes in time of the multilayer electrodeposition, depending on a current density of copper deposition (at constant current density of nickel deposition) was analysed. The cross-sectional micrograph, confirmation of metal multilayer formation and the chemical composition of electrodeposited multilayers were obtained using a scanning electron microscopy. Quantitative chemical analysis of the electrodeposited multilayers shows that deposition of a copper sublayer at current densities of iCu=1, 0.5 and 0.2 mA/square cm is accompanied by nickel co-deposition. The nickel content decreases with decrease in the current density of copper sublayer deposition and is 73, 18 and 4 at.%, respectively. It was ascertained that depolarisation of nickel and overpolarisation of copper phenomena, are accompanied by deposition of Ni/Cu multilayers. The optimal for the sake of chemical composition, current condition of Ni/Cu multilayers electrodeposition from the bath containing Ni(SO3NH2)2x4H2O, CuSO4x5H2O and H3BO3 were proposed from the print of view of chemical composition. The current densities are found to be: iNi=20 mA/square cm and iCu below 0.2 mA/square cm.