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Microstructure and Mechanical Characteristics of the Ternary SnZnAl Lead-Free Alloy

Pietrzak K., Klasik A., Maj M., Sobczak N.

Archives of Foundry Engineering

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2018

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Vol. 18, iss. 3

31--36

EN

The paper describes the studies of ternary SnZn9Al1.5 lead-free alloy from the viewpoint of its mechanical behavior as well as microstructure examined by the light and scanning electron microscopy. The authors focused their attention specifically on the fatigue parameters determined by the original modified low-cycle fatigue method (MLCF), which in a quick and economically justified way allows determination of a number of mechanical parameters based on the measurement data coming from one test sample only. The effect of the addition of 1.5% Al to the binary eutectic SnZn9 alloy on its microstructure and the obtained level of mechanical parameters was analyzed. The phases and intermetallic compounds occurring in the alloy were identified based on the chemical analysis carried out in micro-areas by the SEM/EDS technique. It was shown that the addition of 1.5% Al to the binary eutectic SnZn9 alloy resulted in a more favorable microstructure and consequently had a positive effect on the mechanical parameters of the alloy. Based on the conducted research, it was recommended to use a combinatorial method based on the phase quanta theory to quickly evaluate the microstructure and the original MLCF method to determine a number of mechanical parameters.

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Microstructure and Fatigue Life of the Binary Lead-free Alloys with High Zn Content

Pietrzak K., Klasik A., Maj M., Sobczak N.

Archives of Foundry Engineering

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2018

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Vol. 18, iss. 4

65--70

EN

The results of studies presented in this article are an example of the research activity of the authors related to lead-free alloys. The studies covered binary SnZn90 and SnZn95 lead-free alloys, including their microstructure and complex mechanical characteristics. The microstructure was examined by both light microscopy (LM) and scanning electron microscopy (SEM). The identification of alloy chemical composition in micro-areas was performed by SEM/EDS method. As regards light microscopy, the assessment was of both qualitative and quantitative character. The determination of the geometrical parameters of microstructure was based on an original combinatorial method using phase quantum theory. Comprehensive characterization of mechanical behavior with a focus on fatigue life of alloys was performed by means of the original modified low cycle fatigue method (MLCF) adapted to the actually available test machine. The article discusses the fatigue life of binary SnZn90 and SnZn95 alloys in terms of their microstructure. Additionally, the benefits resulting from the use of the combinatorial method in microstructure examinations and MLCF test in the quick estimation of several mechanical parameters have been underlined.

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Preliminary trials of mass lead free reflow soldering

Faliński W., Kozioł G., Hackiewicz H., Sitek J.

Elektronika : konstrukcje, technologie, zastosowania

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2004

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Vol. 45, nr 8-9

209-212

EN

In Tele and Radio Research Institute we pursue works to be completely prepared to face the lead free assembly implementation due to Restriction of Hazardous Substances Directive comes into force in July 2006. In the article we present results of preliminary experiments of lead free reflow soldering in mass production and deliberations concerning technological aspects reflow soldering. We also present our first results of strength test of the lead free solder joints.

PL

W związku z zakazem stosowania lutów z zawartością ołowiu w montażu elementów na płytkach drukowanych, Instytut Tele- i Radiotechniczny prowadzi badania, aby być w pełni przygotowany do lutowania bezołowiowego przed lipcem 2006. W artykule prezentujemy pierwsze próby bezołowiowego lutowania rozpływowego w skali produkcyjnej. Analizujemy aspekty technologiczne bezołowiowego lutowania rozpływowego oraz prezentujemy nasze pierwsze wyniki prób wytrzymałości połączeń lutowanych.

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Ocena bezołowiowych połączeń otrzymanych w procesie lutowania rozpływowego

Faliński W., Hackiewicz H.

Elektronika : konstrukcje, technologie, zastosowania

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2004

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Vol. 45, nr 12

60-63

PL

W związku z zakazem stosowania Iutów z zawartością ołowiu w montażu elementów na płytkach drukowanych, Instytut Tele- i Radiotechniczny prowadzi badania zmierzające do przygotowania procesu lutowania bezołowiowego przed lipcem 2006 r. W artykule zaprezentowano pierwsze próby bezołowiowego lutowania rozpływowego w skali produkcyjnej. Przeanalizowano aspekty technologiczne bezołowiowego lutowania rozpływowego oraz zaprezentowano pierwsze wyniki prób wytrzymałości połączeń lutowanych.

EN

In Tele- and Radio Research Institute we pursue works to be completely prepared to face the lead free assembly implementation due to Restriction of Hazardous Substances Directive comes into force in July 2006. In the article we present results of preliminary experiments of lead free reflow soldering in mass production and deliberations concerning technological aspects reflow soldering. We also present our first results of strength test of the lead free solder joints.