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Content available Heat dissipation and temperature distribution in long interconnect lines
Gnidzińska K., Mey G., Napieralski A.
Bulletin of the Polish Academy of Sciences. Technical Sciences
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2010
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Vol. 58, nr 1
119-124
EN
Thermal and time delay aspects of long interconnect lines have been investigated. To design a modern integrated circuit we need to focus on very long global interconnects in order to achieve the desired frequency and signal synchronization. The long interconnection lines introduce significant time delays and heat generation in the driver transistors. Introducing buffers helps to spread the heat production more homogenously along the line but consumes extra power and chip area. To ensure the functionality of the circuit, it is compulsory to give priority to the time delay aspect and then the optimized solution is found by making the power dissipation as homogenous as possible and consequently the temperature distribution T (relative to ambient) as low as possible. The technology used for simulations is 65 nm node. The occurring phenomena have been described in a quantitative and qualitative way.
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