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1 International Journal of Applied Mechanics and Engineering

1 2012

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Thermal-hydraulic performance of a CNT based pin fin heat sink for electronics cooling

Ismil M. F., Rashid M. A. I., Mahbub M.

International Journal of Applied Mechanics and Engineering

2012

Vol. 17, no. 4

1149-1162

This paper describes 3D numerical simulation of the fluid flow and heat transfer characteristics in a pin fin heat sink under constant heat flux condition. Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packaging because of its extraordinarily high thermal conductivity. Fabricated onto a silicon substrate to form micro-channels, the CNT based cooling fins show high heat dissipation efficiency. The simulation is performed for the Reynolds number from 7 to 60 with channel hydraulic diameter 1.22 mm. The results are used to derive the Nusselt number, pressure drop, thermal resistance etc.