The aim of the article is application of Six Sigma method in glue applying process during assembling of IGBT modules of products family SEMiX3 performed in manufacture of SEMIKRON company. There are also used other tools and methods as Pareto diagram, Ishikawa diagram, hypothesis testing, Voice of the customer, involved in DMAIC cycle. There was found, that the most important impact of the glue applying process is the amount of glue. This is related to time savings and also Money savings as well as reduce the number of repairs.
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