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1

Thermal Desorption of Argon Implanted into Gallium Arsenide

Turek Marcin, Droździel Andrzej, Pyszniak Krzysztof, Węgierek Paweł

Advances in Science and Technology. Research Journal

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2022

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Vol. 16, no 4

318--326

EN

Thermal desorption of Ar implanted with energies 150 keV and 100 keV with fluence 1×10^16 cm^-2 into GaAs is considered. A sudden release of Ar is observed in temperature range 1100 -1180 K as a single narrow peak in TDS (Thermal Desorption Spectroscopy) spectra. This is accompanied by a strong background signal from atmospheric Ar trapped in various parts of the spectrometer. Desorption peak shift analysis allows estimation of desorption activation energy values - these are 3.6 eV and 2.5 eV for implantation energies 150 keV and 100 keV, respectively. These results are comparable to that measured for Ar implanted into germanium target.

2

First vertical-cavity surface-emitting laser made entirely in Poland

Gębski Marcin, Śpiewak Patrycja, Kołkowski Walery, Pasternak Iwona, Głowadzka Weronika, Nakwaski Włodzimierz, Sarzała Robert P., Wasiak Michał, Czyszanowski Tomasz, Strupiński Włodzimierz

Bulletin of the Polish Academy of Sciences. Technical Sciences

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2021

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Vol. 69, nr 3

art. no. e137272

EN

The paper presents the first vertical-cavity surface-emitting lasers (VCSELs) designed, grown, processed and evaluated entirely in Poland. The lasers emit at »850 nm, which is the most commonly used wavelength for short-reach (<2 km) optical data communication across multiple-mode optical fiber. Our devices present state-of-the-art electrical and optical parameters, e.g. high room-temperature maximum optical powers of over 5 mW, laser emission at heat-sink temperatures up to at least 95°C, low threshold current densities (<10 kA/cm2) and wall-plug efficiencies exceeding 30% VCSELs can also be easily adjusted to reach emission wavelengths of around 780 to 1090 nm.

3

Application of poly-energy implantation with H+ ions for additional energy levels formation in GaAs dedicated to photovoltaic cells

Węgierek Paweł, Pietraszek Justyna

Archives of Electrical Engineering

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2019

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Vol. 68, nr 4

925--931

EN

: The aim of this article is to present the results of research aimed at confirmation whether it is possible to form an intermediate band in GaAs implantation with H+ ions. The obtained results were discussed with particular emphasis on possible applications in the photovoltaic industry. As it is commonly known, the idea of intermediate band solar cells reveals considerable potential as the most fundamental principle of the next generation of semiconductors solar cells. In progress of the research, a series of GaAs samples were subjected to poly-energy implantation of H+ ions, followed by high-temperature annealing. Tests were conducted using thermal admittance spectroscopy, under conditions of variable ambient temperature, measuring signal frequency in order to localize deep energy levels, introduced by ion implantation. Activation energy ∆E was determined for additional energy levels resulting from the implantation of H+ ions. The method of determining the activation energy value is shown in Fig. 2 and the values read from it are σ0 = 10−9 (Ω·cm)−1 for 1000/T0 = 3.75 K−1 and σ1 = 1.34 × 10−4 (Ω·cm)−1 for 1000/T1 = 2.0 K−1 . As a result, we obtain ∆E ≈ 0.58 eV. It was possible to identify a single deep level in the sample of GaAs implanted with H+ ions. Subsequently, its location in the band gap was determined by estimating the value of ∆E. However, in order to confirm whether the intermediate band was actually formed, it is necessary to perform further analyses. In particular, it is necessary to implement a new analytical model, which takes into consideration the phenomena associated with the thermally activated mechanisms of carrier transport as it was described in [13]. Moreover, the influence of certain parameters of ion implantation, post-implantation treatment and testing conditions should also be considered.

4

Monokryształy SI GaAs o orientacji [310] jako materiał na podłoża do osadzania warstw epitaksjalnych

Hruban A., Orłowski W., Strzelecka S., Piersa M., Jurkiewicz-Wegner E., Mirowska A., Rojek A.

Materiały Elektroniczne

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2013

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T. 41, nr 2

18--25

PL

Celem pracy było dowiedzenie warunków otrzymywania półizolacyjnych monokryształów arsenku galu (SI-GaAs) o orientacji [310] i średnicy 2” i 3”. Synteza i monokrystalizacja przebiegała pod wysokim ciśnieniem metodą LEC (Liquid Encapsulated Czochralski). Dobrano warunki termiczne i technologiczne pozwalające otrzymywać monokryształy o średnicy 2” i 3” i ciężarze odpowiednio 2000 g i 3000 g. Monokryształy posiadały wysokie parametry elektryczne (ρ, μ) - typowe dla monokryształów półizolacyjnych o wysokim stopniu czystości. Gęstość dyslokacji kryształów [310] była o (0,5 - 1,5) rzędu niższa w porównaniu z kryształami o orientacji [100]. Warstwy epitaksjalne osadzone na podłożach o orientacji [310] wykazały lepszą morfologię powierzchni w porównaniu z osadzonymi na podłożu [100].

EN

The subject matter of this research work included the synthesis and growth conditions of [310]-oriented SI GaAs (semi-insulating gallium arsenide) crystals 2” or 3” in diameter. High pressure processes were applied for the synthesis and growth of LEC crystals. Thermal conditions and process parameters were determined to obtain single crystals 2” and 3” in dia, 2000 g and 3000 g in weight, respectively. They had high electrical parameters (ρ, μ), characteristic of semi-insulating high purity GaAs. Dislocation density (EPD) of [310]-oriented crystals was (0.5 - 1.5) orders of magnitude lower than in the case of the [100]-orientation. Epitaxial layers grown on [310]-oriented substrates exhibited better surface morphology than those deposited on [100]-oriented substrates.

5

Research on Jump Mechanism of Electric Charge Transfer Probability in Gallium Arsenide Irradiated with H+ Ions

Węgierek P., Billewicz P.

Przegląd Elektrotechniczny

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2012

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R. 88, nr 11b

364-365

EN

In the article the results of research on gallium arsenide irradiated with H+ ions have been presented as well as occurred correlations between probability of electron’s jump and sample annealing temperature have been discussed. Obtained results have confirmed that value of probability is strictly connected with the type of radiation defects formed as a consequence of irradiating tested sample with H+ ions.

PL

W artykule przedstawiono rezultaty badań arsenku galu naświetlonego jonami H+ oraz omówiono występujące w nim zależności prawdopodobieństwa wystąpienia przeskoku elektronu od temperatury wygrzewania próbki. Otrzymane wyniki potwierdzają, że wartość prawdopodobieństwa przeskoków jest ściśle związana z typem defektów radiacyjnych, powstałych w wyniku naświetlania materiału badawczego jonami H+.

6

Zintegrowany proces otrzymywania monokryształów SI GaAs metodą Czochralskiego z hermetyzacją cieczową

Hruban A., Orłowski W., Mirowska A., Strzelecka S., Piersa M., Jurkiewicz-Wegner E., Materna A., Dalecki W.

Materiały Elektroniczne

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2012

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T. 40, nr 3

38-47

PL

Standardowa technologia otrzymywania półizolujących monokryształów SI GaAs składa się z 3 etapów tzn. syntezy, monokrystalizacji i obróbki termicznej, która jest niezbędna dla uzyskania rezystywności ρ ≥ 107 Ohmcm i ruchliwości nośników ładunku μ ≥ 5000 cm2/Vs. Synteza i monokrystalizacja są wykonywane w ramach jednego procesu w wysokociśnieniowym urządzeniu Czochralskiego. Standardowa obróbka termiczna jest procesem osobnym polegającym na wygrzewaniu kryształów w zamkniętych ampułach kwarcowych w atmosferze par As. Proces ten jest pracochłonny, wymaga dodatkowych urządzeń oraz zwiększa koszty. Przedmiotem pracy było uproszczenie technologii wytwarzania monokryształów SI GaAs przez obróbkę cieplną zintegrowaną z procesami syntezy i monokrystalizacji. Przeprowadzono zintegrowane procesy monokrystalizacji i wygrzewania otrzymując monokryształy o średnicach 2" i 3" i ciężarze ~ 3 kg. Własności takich kryształów porównano z monokryształami wytwarzanymi w procesach standardowych. Wykazano, że właściwości fizyczne takie jak: rezystywność, ruchliwość i gęstość dyslokacji nie zależą od sposobu prowadzenia procesu (standardowy, zintegrowany) lecz są tylko funkcją temperatury wygrzewania. Proces zintegrowany upraszcza technologię wytwarzania, a jednocześnie obniża poziom stresów termicznych eliminując pękanie kryształów.

EN

A standard technological process of manufacturing SI GaAs single crystals consists of 3 steps, namely synthesis, crystal growth and thermal annealing, which are necessary to reach high resistivity (ρ ≥ 107 Ohmcm) and high carrier mobility (μ ≥ 5000 cm2/Vs). Usually both synthesis and crystal growth are realized in one process in a high pressure Czochralski puller. The thermal annealing process is carried out in a sealed quartz ampoule under arsenic (As) vapor pressure. This increases the costs of the process due to a need for the equipment and, in addition, is time consuming. The subject matter of this work was the improvement of the SI GaAs technology by integrating the thermal annealing step with synthesis and crystal growth. The integrated manufacturing processes of SI GaAs crystals with 2" and 3" in diameter and ~ 3000 g in weight were performed. Their physical properties were compared with these of the crystals obtained in a standard process. Preliminary results of this work indicate that it is possible to improve the SI GaAs technology and decrease the manufacturing costs. They also prove that thermal stress in the crystals can be decreased, as a result of which cracks will not appear during the mechanical treatment (cutting, lapping).

7

Wykorzystanie zaawansowanych trybów mikroskopii sił atomowych w badaniach struktur i przyrządów półprzewodnikowych

Szyszka A., Macherzyński W., Prażmowska J., Wośko M., Stafiniak A., Gryglewicz J., Ramiączek-Krasowska M., Paszkiewicz B., Jankowski B., Ściana B., Paszkiewicz R., Tłaczała M.

Elektronika : konstrukcje, technologie, zastosowania

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2012

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Vol. 53, nr 2

55-58

PL

W pracy przedstawione zostały wyniki charakteryzacji lokalnych właściwości detektorów MSM (Metal-Semiconductor-Metal) oraz rezystancyjnych wytworzonych w warstwach GaN, struktur tranzystorów unipolarnych wykonanych w warstwach azotku galu, cienkich warstw metali katalitycznych, heterostruktur AlAs/AIGaAs/GaAs oraz powierzchni węglika krzemu wykonanych różnymi trybami mikroskopii sił atomowych. Badania zostały przeprowadzone metodami Skaningowej Mikroskopii Potencjału Powierzchniowego SSPM (ang. Scanning Surface Potential Microscopy), Skaningowej Mikroskopii Rezystancji Rozproszonej SSRM (ang. Scanning Spreading Resistance Microscopy) oraz obrazowania fazowego.

EN

In this work characterization results of MSM (metal-semiconductor-metal) and resistive detectors fabricated in gallium nitride layers, GaN based unipolar transistors, thin catalytic metal layers, AlAs/AIGaAs/GaAs heterostructures and silicon carbide surface by various techniques of atomic force microscopy are presented. The examinations were performed by Scanning Surface Potential Microscopy (SSPM), Scanning Spreading Resistance Microscopy (SSRM) and in phase imaging mode.

8

Mechanizm przewodnictwa elektrycznego w arsenku galu implantowanym jonami

Węgierek P., Kowalski M.

Elektronika : konstrukcje, technologie, zastosowania

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2009

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Vol. 50, nr 9

42-44

PL

W artykule przedstawiono rezultaty badań właściwości elektrycznych arsenku galu zdefektowanego polienergetyczną implantacją jonów H⁺. Dokonano analizy mechanizmu przewodzenia prądu elektryczego wykorzystując zależności częstotliwościowe i temperaturowe przewodności elektrycznej. Na jej podstawie wykazano, że całkowita konduktywność jest superpozycją dwóch składowych: pasmowej, która dominuje przy niskich częstotliwościach, i skokowej, charakterystycznej dla dużych wartości częstotliwości.

EN

The article presents results of testing electric properties of gallium arsenide defected with poly-energy implantation of H⁺ ions. An analysis of electric current conduction mechanism has been performed based on frequency and temperature dependences of electrical conductivity. It has been shown that total conductivity is a superposition of two components: the band one that dominates at low frequencies and the jump one that is characteristic for high frequency values.

9

Damage distributions in GaAs single crystal irradiated with 84Kr (394 MeV), 209Bi (710 MeV) and 238U (1300 MeV) swift ions

Didyk A. Y., Komarov F. F., Vlasukova L. A., Gracheva E. A., Hofman A., Yuvchenko V. N., Wiśniewski R., Wilczyńska T.

Nukleonika

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2008

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Vol. 53, No. 2

77-82

EN

We are presenting a study of damage distribution in GaAs irradiated with 84Kr ions of energy EKr = 394 MeV up to the fluence of 5 × 1012 ion/cm-2. The distribution of damage along the projected range of 84Kr ions in GaAs was investigated using selective chemical etching of a single crystal cleaved perpendicularly to the irradiated surface. The damage zone located under the Bragg peak of 84Kr ions was observed. Explanation of the observed effects based on possible processes of channeling of knocked target atoms (Ga and As) is proposed.

10

Stanowisko do badania temperaturowych i częstotliwościowych zależności właściwości elektrofizycznych implantowanych półprzewodników

Kołtunowicz T.

Elektronika : konstrukcje, technologie, zastosowania

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2007

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Vol. 48, nr 10

37-40

PL

W pracy przedstawiono komputerowe stanowisko do badania temperaturowych i częstotliwościowych zależności właściwości elektrofizycznych półprzewodników, które zostało zbudowane w Katedrze Urządzeń Elektrycznych i Techniki Wysokich Napięć Politechniki Lubelskiej.

EN

In the paper are presented computer station to testing temperature and frequency dependence of electrophysical properties of semiconductors, which was built in Department of Electrical Devices and High Voltage Technology Lublin University of Technology.

11

Resonant cavity enhanced photonic devices.

Bugajski M., Muszalski J., Mroziewicz B., Regiński K., Ochalski T.J.

Optica Applicata

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2001

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Vol. 31, nr 2

273-288

EN

We review our recent works on technology, basic physics and applications of one-dimensional photonic structures. We demonstrate spontaneous emission control in In/sub x/Ga/sub 1-x/As/GaAs planar microcavities with DBR reflectors. The room temperature emission in lambda -sized cavities is enhanced in comparison with its free space value, while in lambda /2-sized cavities suppression of spontaneous emission is observed. The characteristics of spontaneous emission in microcavities depend on the wavelength difference between the emitter and the cavity resonance. It has been shown that ideal tuning of the cavity can be achieved by adjusting sample temperature. In general, observed trends are in agreement with theoretical predictions. These changes to the spontaneous emission process directly affect vertical-cavity laser (VCSEL) properties. An increased coupling efficiency of spontaneous emission into the lasing mode is observed in VCSELs with lambda -sized cavities. We demonstrate the operation of resonant-cavity light emitting diodes (RC LED) and optically pumped VCSELs developed recently at the Department of Physics and Technology of Low Dimensional Structures of the Institute of Electron Technology. The epitaxial growth issues, fabrication technology and basic characteristics of these devices are discussed

12

Operation of arsenide diode lasers at elevated temperatures

Czyszanowski T.

Optica Applicata

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2001

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Vol. 31, nr 2

301-311

EN

Some design modification and optimisation of the GaAs/(AlGa)As separate-confinement-heterostructure (SCH) as well as the graded-index separate-confinement-heterostructure (GRIN-SCH) semiconductor lasers are discussed to reduce their threshold concentrations at elevated temperatures. A detailed optical model of arsenide lasers is used to compare an impact of some structural details on lasing thresholds at various temperatures. In the analysis, both optical gain and losses are modelled rigorously. It has been demonstrated that operation of the arsenide lasers considered is not changing dramatically at elevated temperatures not exceeding 400 K.

13

High-performance 980-nm strained-layer InGaAs/GaAs quantum-well lasers

Bugajski M., Regiński K., Mroziewicz B., Kubica J.M., Sajewicz P., Piwoński T., Zbroszczyk M.

Optica Applicata

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2001

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Vol. 31, nr 2

267-271

EN

Reports fabrication of strained-layer InGaAs/GaAs separate-confinement-heterostructure single-quantum-well (SCH SQW) lasers operating in the wavelength range of 980 nm. Design process of the devices involved simulation of their above-threshold operation including all relevant physical phenomena. The lasers were characterized at room temperature in the pulsed operation regime at frequency v=5 kHz and pulse length tau =200 ns. Threshold current densities of the order J/sub th/=280 A/cm/sup 2/ and differential efficiency eta =0.40 W/A were obtained for devices with cavities of 700 mu m in length and broad contacts of 100 mu m in width

14

Design considerations for GaAs/(AlGa)As SCH and GRIN-SCH quantum-well laser structures. II. The results

Czyszanowski T., Wasiak M., Nakwaski W.

Optica Applicata

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2001

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Vol. 31, nr 2

325-336

EN

A detailed optical model of complex multi-layered structures of the separate-confinement-heterostructure (SCH) lasers as well as graded-index (GRIN) SCH lasers presented in the first part of the paper is used to discuss some of the possible modifications of their structure to reduce room-temperature thresholds. Recommended design parameters have been found for each structure. Surprisingly, performance of relatively simple SCH lasers is found to be at least comparable with that of much more complex GRIN-SCH lasers.

15

Design considerations for GaAs/(AlGa)As SCH and GRIN-SCH quantum-well laser structures. I. The model

Czyszanowski T., Wasiak M., Nakwaski W.

Optica Applicata

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2001

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Vol. 31, nr 2

313-323

EN

Some design modifications and optimization of the GaAs/(AlGa)As separate-confinement-heterostructure (SCH) as well as graded-index separate-confinement-heterostructure (GRIN-SCH) semiconductor lasers to reduce their room-temperature (RT) thresholds are discussed. To this end, a detailed optical model of arsenide diode lasers is developed and used to compare the impact of some structure details on RT lasing thresholds. In the model presented in the first part of the paper, both optical gain and losses are modeled rigorously. Optical fields within complex multi-layered structures of the SCH lasers are found using the downhill method. Threshold carrier concentrations are determined from the general balance of radiation gain and losses. As a result of the simulation, recommended basic design parameters for the above structures are deduced in the second part of the paper.