Wyniki wyszukiwania - BazTech

Ograniczanie wyników

1 Journal of Achievements in Materials and Manufacturing Engineering

1 2007

Znaleziono wyników: 1

Liczba wyników na stronie

Wyniki wyszukiwania

Wyszukiwano:
w słowach kluczowych: float polishing

Sortuj według:

Ogranicz wyniki do:

Study on new float polishing with the MCF

Shimada K., Matsuo Y., Yamamoto K., Zheng Y.

Journal of Achievements in Materials and Manufacturing Engineering

2007

Vol. 23, nr 2

91-94

Purpose: As a continuation of a previous paper, the report demonstrates the various possibilities of float polishing utilizing the present improved magnetic compound fluid (MCF). The MCF developed by one authors, Shimada, in 2001, was improved by the addition of alpha-cellulose, thereby achieving a clearance as great as 8 mm as shown in another paper. The present paper describes the possibility of the application of the MCF float polishing technique with alpha-cellulose. Design/methodology/approach: First, the results obtained under various polishing conditions of the MCF float polishing technique are described. These conditions include the various shapes of the magnet employed in the polishing tool, magnetic field strength, the concentration of alpha-cellulose, the motion of the specimen, the existence of a magnet fixed underneath the polished specimen, and initial surface roughness. Secondly, the present MCF float polishing technique can be used in many types of polishing, including polishing the inner surface of an acrylic resin tube, a wide flat surface through the use of a orbital polishing tool, and simultaneous float polishing of all surfaces of a three-dimensional complex shape. In addition, as other examples, the polishing on the integrated circuit (IC) substrate is shown. Findings: By the various polishing conditions of the MCF float polishing technique, the polishing effect is changed. On the other hand, as for the many applications of the MCF float polishing, inner surface, wide flat surface, rough initial surface, three-dimensional complex shape and IC substrate can be polished. Research limitations/implications: The data under various polishing conditions of the MCF float polishing technique helps to clarify the present polishing technique's possible practical applications. As shown in a previous paper, since MCF contains long magnetic clusters, the present polishing technique allows float polishing with large clearance. Therefore, many applications of the MCF float polishing are useful in the polishing fields. Practical implications: The present study indicates the practical application in the polishing. Originality/value: The present technique of MCF float polishing is new in the field of float polishing. In addition, the ordinary float polishing technique having large clearance has not been proposed. Therefore, the present paper is very useful in the polishing field.