W pracy dokonano analizy nieniszczących metod oceny połączeń adhezyjnych, na podstawie której wskazano na predystynkcje metody ultradźwiękowej do oceny tych połączeń. Krytyczne ujęcie problemu pozwoliło sformułować własne postulaty badawcze, dotyczące ultradźwiękowych badań przyczepności powłok regeneracyjnych. Przedstawiono algorytm realizacji zadań badawczych w celu opracowania ultradźwiękowej metody oceny stanu połączenia powłoki z podłożem na różnych etapach jego istnienia.
EN
The paper deals with an analysis of the methods of nondestructive evaluation of adherence of renovative coatings. The introduction presents a conception of adherence of renovative coatings and a purpose of the work. Next, an analysis of some nondestructive methods of evaluation of adhesive bonds is carried out. From among of various nondestructive methods, a group of ultrasonic methods possesses a particular predispositions to evaluation of adhesive bonds, especially to the bonds between coating and substrate. Some ultrasonic waves, as longitudinal, transverse, surface, subsurface, can be used not only for defects detection on the boundary region between coating and substrate, but also for monitoring of the bonds type coating-substrate during their mechanical loading. On the basis of particular possibilities of ultrasonic waves, and the needs of the adherence evaluation, some research tasks to solve the problem of nondestructive evaluation of the adherence of renovative coatings are suggested in the work. As the results of the analysis, a diagnostic approach to the studied problem of adhesion evaluation is presented. This approach consists of treating of ultrasonic evaluation of the bond between coatings and substrate as the method of an condition assessment of these bonds. Besides of some research tasks, the way their connections, in the form of algorithm is shown. In the algorithm those tasks are logically comprised. The realization of the tasks leads to the elaboration of the method of condition evaluation of the bond between coating and substrate on various stages of life-period of the bonds considered.
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