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Electromigration failure prediction and reliability evaluation of solder bumps for FCBGA package

Zhang Y.

Engineering Transactions

2015

Vol. 63, iss. 2

215--232

Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper. The driving forces in electromigration include electron wind force, stress gradient, temperature gradient as well as atomic density gradient. The electromigration simulation is performed on flip chip ball grid array (FCBGA) package based on ADI method, and the simulation results for void generation and time to failure (TTF) have a reasonably good correlation with the testing results. Orthogonal experimental design has been used to evaluate the effect of design parameters on TTF of electromigration. Based on this study, some practical recommendations are made to optimize the package design and improve the solder bump electromigration reliability.

Oporowa metoda badania elektromigracji

Frączek D.

Zeszyty Naukowe. Mechanika / Politechnika Opolska

2009

z. 94

25-26

The article includes a short consideration of: the concept of electromigration, the issue of the resistively method of the electromigration research, the process of the experiment. The results obtained in Zef and D for the hydrogen in vanadium are also included.

Izotachoforeza, technika stara, ale…

Kosobucki P., Buszewski B.

Analityka : nauka i praktyka

2004

nr 4

8--15

Izotachoforeza stanowi alternatywną technikę - stosowaną w analizie substancji o charakterze jonowym, do chromatografii jonowej (IC) lub strefowej elektroforezy kapilarnej (CZE).