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Experimental investigation of heat transfer and aerodynamic drag of novel heat sinks with lamellar fins

Terekh Aleksandr, Rudenko Aleksandr, Alekseik Yevhenii

Archives of Thermodynamics

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2024

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Vol. 45, no 1

53--63

EN

Heat transfer and aerodynamic drag of novel small-sized heat sinks with lamellar fins, designed for electronic cooling, were experimentally investigated under conditions of forced convection in the range of Reynolds numbers 1 250-10 500. It was found that a gradual reduction in the fin spacing from 6 mm to 3 mm with a 29° angle of taper between the outermost fins leads to an increase in the heat transfer intensity by 15-32% with a significant increase in aerodynamic drag compared to the surface with a constant fin spacing of 6 mm. Incomplete cross-section cutting of fins at the relative depth of 0.6 in addition to the gradual reduction in the fin spacing provides aerodynamic drag decrease by 520% and increase of heat transfer intensity by 1820% in comparison with the similar heat sink without fins cutting. Proposed novel designs of heat sinks enabled us to decrease by 7°С–16°С the maximum overheating of the heat sink's base in the flow speed range from 2.5 m/s to 7.5 m/s at constant heat load. To ensure a constant value of maximum overheating of the heat sink base the inlet flow velocity for the surface with constant fin spacing should be 1.6-2 times higher than that for the heat sink with 29° taper angle between outermost fins and partially fins cutting. In this case, the aerodynamic drag for the latter will be higher only by 1.6-2.7 times, which is quite acceptable.

2

Study of heat transfer during pool boiling on minifins surface coated with carbon nanotubes

Strąk E., Pastuszko R., Kłosowiak R., Urbaniak R.

Transactions of the Institute of Fluid-Flow Machinery

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2015

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nr 128

59--72

EN

The article describes the study of heat transfer during pool boiling on minifins surface coated with nanostructure. This is a molecular level technology used in engineering or mechanical factory. A surface with carbon nanotubes (CNTs) is highly effective in reducing the superheat incipience and enhancing both the heat flux and heat transfer coefficient. The paper focuses on the comparison of the surfaces, on which pool boiling heat transfer occurs, i.e., on minifins coated with carbon nanotubes (MF+N) with surfaces formed by sintering the woven copper wire mesh to the minifins tips (MF+M) and with plain minifins surface (MF). The experiments were carried out for two boiling fluids: water and ethyl alcohol. The purpose of the presented study was to find out which of those tested surfaces and fluids could be the best alternative for use in the cooling of electronic devices and which surfaces could be used as thermosyphon or heat pipe evaporator.

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Chłodzenie współczesnych procesorów komputerowych. Część 2. Badania doświadczalne mikrostrugowo – minikanałowego modułu do chłodzenia procesora

Andrzejczyk R., Muszyński T.

Technika Chłodnicza i Klimatyzacyjna

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2013

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nr 9

382--384

PL

Artykuł poświęcony ocenie standardowych i współczesnych metod chłodzenia procesorów komputerowych. W jego części pierwszej („TCHK”, nr. 8/2013, s. 332-338) przedstawiono charakterystykę techniczną typowych układów chłodzenia takich procesorów oraz wyniki badań doświadczalnych wykonanych przez autorów z konwencjonalnymi konstrukcjami radiatorów. W publikacji pokazano zdjęcia wykonane kamera termowizyjną, obrazujące m. innymi rozkład przepływu strumienia powietrza w badanych wymiennikach ciepła, a także przedstawiono ich charakterystyki pracy. W części drugiej artykułu zaprezentowano specjalne stanowisko przeznaczone do badania zaprojektowanego modułu mikrostrugowo-mikrokanałowego, przeznaczonego do chłodzenia procesora komputerowego wraz wstępnymi wynikami jego badań cieplnych.

EN

Article is devoted to the assessment of standard and contemporary methods of cooling of computer processors. In the first part ("TCHK", no. 8/2013, pp. 332-338) describes the technical characteristics of conventional cooling systems such processors and the results of experimental studies carried out by the authors with conventional radiators structures. The paper shows the infrared camera pictures taken, reflecting among other things the distribution of air flow in the test heat exchangers and presents their operating characteristics. The second part of the article presents a special position for the test module designed channel, which is designed to cool the computer processor and preliminary results of the thermal test.

4

Heat pipes and solid sorption coolers for the electronic equipment cooling

Vasiliev L.

Zeszyty Naukowe Politechniki Świętokrzyskiej. Mechanika

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1999

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Z. 67

127--140

EN

Modern thermal control systems for the electronic cooling are considering such as heat pipes and two-phase thermosyphons for low, middle and high power electronic elements. Thermally driven sold sorption system are discussed as an emergency cooling possibility for the future cooling of electronics.