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Electromigration failure prediction and reliability evaluation of solder bumps for FCBGA package

Zhang Y.

Engineering Transactions

2015

Vol. 63, iss. 2

215--232

Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper. The driving forces in electromigration include electron wind force, stress gradient, temperature gradient as well as atomic density gradient. The electromigration simulation is performed on flip chip ball grid array (FCBGA) package based on ADI method, and the simulation results for void generation and time to failure (TTF) have a reasonably good correlation with the testing results. Orthogonal experimental design has been used to evaluate the effect of design parameters on TTF of electromigration. Based on this study, some practical recommendations are made to optimize the package design and improve the solder bump electromigration reliability.

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Nowak D., Stafiniak A., Dziedzic A.

Materials Science Poland

2014

Vol. 32, No. 2

247--251

Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag electrode patterns in temperature range up to 300 °C under voltage bias were examined. The leakage characteristics of electrodes with 100 μm spacing at 50 V dc bias as a function of time and temperature are presented and analyzed. Scanning electron microscope (SEM) equipped with the energy-dispersive X-ray spectroscopy (EDX) detector was applied for determination of metal ions transport. Test structures with Au-based conductive material are much more resistant to electromigration than Ag-based layers.

Izotachoforeza, technika stara, ale…

Kosobucki P., Buszewski B.

Analityka : nauka i praktyka

2004

nr 4

8--15

Izotachoforeza stanowi alternatywną technikę - stosowaną w analizie substancji o charakterze jonowym, do chromatografii jonowej (IC) lub strefowej elektroforezy kapilarnej (CZE).

Thin dielectric electrodiffusion masks for Ag+ - Na+ ion exchange applications

Mrozek E., Mrozek P.

Journal of Technical Physics

2003

Vol. 44, no 3

289-294

A new method of thin dielectric mask preparation for Ag+ - Na+ ion exchange applications was developed. Electrodiffusion bonding of Al-film to glass was used to obtain very thin dielectric Al2O3 layer in the Al-glass transition zone. After Al removal, the quality of the dielectric mask was tested in Ag pure thermal diffusion and electrodiffusion processes in molten AgNO3.