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1 Journal of Achievements in Materials and Manufacturing Engineering

1 2010

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Crystallographic texture and anisotropy of electrolytic deposited copper coating analysis

Skrzypek S. J., Ratuszek W., Bunsch A., Witkowska M., Kowalska J., Goły M., Chruściel K.

Journal of Achievements in Materials and Manufacturing Engineering

2010

Vol. 43, nr 1

264--268

Purpose: To investigate of texture and microstructure of electrodeposited copper thin films. Design/methodology/approach: Influence of the electrodepositing parameters e.g. applied electric current as variable on texture formation of copper films was studied at presented work. Experiment was done for copper deposition from sulphate bath under galvanostatic and pulse current with different additives in the bath. X-ray examination included texture measurements phase analysis by means of Bragg-Brentano, grazing incidence diffraction and crystallite size using broadening of X-ray diffraction line. Findings: Electrodeposited copper coatings exhibit different texture and microstructure depending on applied conditions in which they were obtained. Pulse and direct current conditions leads to different texture of electrodeposited copper coatings. For each type of current texture depends on deposition time and current intensity. Only in some cases {111} component was obtained. Research limitations/implications: extures of the investigated samples are very sensitive for applied current conditions of electrodepositing. At the copper coatings obtained with reverse current texture components {110} is dominating one. Relations between texture and properties (hardness, Young module and grain size) of copper layer were found. Originality/value: The texture of electrodeposited copper should be influential structural characteristic when anisotropy is considered. It is already known that electromigration depends on texture of copper films.