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1 2006

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Substitution of ecologically hazardous substances in thick-film ceramic interconnection modules

Belavic D., Rocak D., Hrovat M., Fajfar-Plut J., Pavlic J., Macek S., Drozd Z., McGill I., Bukat K.

Prace Przemysłowego Instytutu Elektroniki

2006

nr 153

104-112

The substitution of ecologically "hazardous" materials with acceptable substitutes in thick-film ceramic interconnection module is possible with the lead-free soldering technology and with the new emerging "ecological friendly" thick-film pastes. But using the new materials requires research and estimation of the reliability of new "green" ceramic modules as compared with "conventional" ones. As a case study we designed a thick-film ceramic module which was produced using "ecological friendly" as well as "conventional" materials. Modules were aged under accelerated conditions such as temperature cycling and humidity testing.