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Crystallographic texture and anisotropy of electrolytic deposited copper coating analysis

Skrzypek S. J., Ratuszek W., Bunsch A., Witkowska M., Kowalska J., Goły M., Chruściel K.

Journal of Achievements in Materials and Manufacturing Engineering

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2010

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Vol. 43, nr 1

264--268

EN

Purpose: To investigate of texture and microstructure of electrodeposited copper thin films. Design/methodology/approach: Influence of the electrodepositing parameters e.g. applied electric current as variable on texture formation of copper films was studied at presented work. Experiment was done for copper deposition from sulphate bath under galvanostatic and pulse current with different additives in the bath. X-ray examination included texture measurements phase analysis by means of Bragg-Brentano, grazing incidence diffraction and crystallite size using broadening of X-ray diffraction line. Findings: Electrodeposited copper coatings exhibit different texture and microstructure depending on applied conditions in which they were obtained. Pulse and direct current conditions leads to different texture of electrodeposited copper coatings. For each type of current texture depends on deposition time and current intensity. Only in some cases {111} component was obtained. Research limitations/implications: extures of the investigated samples are very sensitive for applied current conditions of electrodepositing. At the copper coatings obtained with reverse current texture components {110} is dominating one. Relations between texture and properties (hardness, Young module and grain size) of copper layer were found. Originality/value: The texture of electrodeposited copper should be influential structural characteristic when anisotropy is considered. It is already known that electromigration depends on texture of copper films.

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Modeling the self-annealing in electroplated copper films

Freundlich P.

Zeszyty Naukowe. Mechanika / Politechnika Opolska

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2004

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z. 78

73-78

EN

A simple phenomenological model describing experimentally observed self-annealing in copper thin films at room temperature was developed. The model proposes that the rate of grain size evolution depends primarily on the initial grain size of the as-deposited film and that the observed abnormal grain growth is viable only after desorption of incorporated additives. By calibrating to the measured data, the model has predictive capabilities for the normalized resistivity evolution of thin copper films used in the semiconductor industry.

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Electroplating of copper interconnects: A cyclic voltammetry study

Freundlich P., Kubečka P.

Zeszyty Naukowe. Mechanika / Politechnika Opolska

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2004

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z. 78

79-84

EN

The role of additives in the electroplating of copper films deposited from sulfuric acid - copper sulfate solution was investigated by the cyclic voltammetry. Strong effects of additives were found both during the underpotencial deposition and in the bulk deposition demonstrating the leveling, suppressing and accelerating abilities of these organic compounds.