Wyniki wyszukiwania - BazTech

Ograniczanie wyników

Znaleziono wyników: 3

Liczba wyników na stronie

Wyniki wyszukiwania

Wyszukiwano:
w słowach kluczowych: chemosensors

Sortuj według:

Ogranicz wyniki do:

Dispersion Curves of Love Waves in Elastic Waveguides Loaded with a Newtonian Liquid Layer of Finite Thickness

Kiełczyński Piotr, Szalewski Marek, Balcerzak Andrzej, Wieja Krzysztof

Archives of Acoustics

2020

Vol. 45, No. 1

19--27

In this paper, the authors analyse the propagation of surface Love waves in an elastic layered waveguide (elastic guiding layer deposited on an elastic substrate) covered on its surface with a Newtonian liquid layer of finite thickness. By solving the equations of motion in the constituent regions (elastic substrate, elastic surface layer and Newtonian liquid) and imposing the appropriate boundary conditions, the authors established an analytical form of the complex dispersion equation for Love surface waves. Further, decomposition of the complex dispersion equation into its real and imaginary part, enabled for evaluation of the phase velocity and attenuation dispersion curves of the Love wave. Subsequently, the influence of the finite thickness of a Newtonian liquid on the dispersion curves was evaluated. Theoretical (numerical) analysis shows that when the thickness of the Newtonian liquid layer exceeds approximately four penetration depths 4δ of the wave in a Newtonian liquid, then this Newtonian liquid layer can be regarded as a semi-infinite half-space. The results obtained in this paper can be important in the design and optimization of ultrasonic Love wave sensors such as: biosensors, chemosensors and viscosity sensors. Love wave viscosity sensors can be used to assess the viscosity of various liquids, e.g. liquid polymers.

Spectroscopic and Thermal Studies of Magnesium(II), Barium(II), Zinc(II), Copper(II), Lanthanum(III) and Aluminium(III) Comlexes with 3-Phenyl-1-methylpyrazolo[3,4-b}quinolino-6-carboxylic Acid

Kowalczyk B., Brągiel P., Kapuśniak J., Giełzak-Koćwin K., Tsvirko M., Siemion P., Jarosz B.

Polish Journal of Chemistry

2005

Vol. 79 / nr 11

1721-1730

Magnesium(II), barium(II), zinc(II), copper(II), lanthanum(III) and aluminium(III) complexes with 3-phenyl-1-methylpyrazolo[3,4-b]quinlino-6-carboxylic acid (HPQ) were stud ied by IR and EPR methods, TG-DSC ther mal analysis, powder X-ray method, absorption and fluorescence spectroscopy. The IR spectra suggest that the carboxylate ligand acts as mono- or bidentate species. EPR spectra indi ate the dimerization of copper(II) complex. During thermal decomposition the hy drated complexes lose all the crystallization and coordination water molecules and decompose gradually to oxides, and to BaCO3 in the case of barium(II) complex. The powder fluorescence spectra in dicated the differences in emission of ligand and zinc(II), magnesium(II), aluminium(III) and copper(II) complexes.

Materiały podłożowe i metody wykonywania połączeń struktura - podłoże obudowy. Część 2

Krzesaj-Janyszek B.

Elektronika : konstrukcje, technologie, zastosowania

1998

Vol. 39, nr 10

10-15

Połączenie struktury czujnika z podłożem obudowy stanowi pierwszy etap technologii montażu. Podstawową zasadą przy montażu struktur krzemowych jest to, aby właściwości materiałów użytych do montażu były takie same lub zbliżone do parametrów krzemu i warstw naniesionych na strukturze. W artykule opisano wiele typów podłoży, materiałów, z których są one wykonane, technologię wytwarzania podłoży oraz metody łączenia struktur czujników z podłożami.

Bonding between chip and substrates of package is the firs step of packaging process. The basic principle of packaging is: proprieties of all materials used in assembling process' must be similar to silicon as close as it is possible. These are a lot of materials for substrates and the suitable methods of connecting chip with substrate. In this paper the development of methods of producing substrates and bonding techniques between substrates and chips is received.