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1

Localization of component lead inside a THT solder joint for solder defects classification

Fonseka C. L. S. C., Jayasinghe J. A. K. S.

Journal of Achievements in Materials and Manufacturing Engineering

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2017

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Vol. 83, nr 2

57--66

EN

Purpose: Automatic Optical Inspection (AOI) systems, used in electronics industry have been primarily developed to inspect soldering defects of Surface Mount Devices (SMD) on a Printed Circuit Board (PCB). However, no commercially available AOI system exists that can be integrated to a desktop soldering robotic system, which is capable of identifying soldering defects of Through Hole Technology (THT) solder joints along with the soldering process. In our research, we have implemented an AOI platform that is capable of performing automatic quality assurance of THT solder joints in a much efficient way. In this paper, we have presented a novel approach to identify soldering defects of THT solder joints, based on the location of THT component lead top. This paper presents the methodologies that can be used to precisely identify and localize THT component lead inside a solder joint. Design/methodology/approach: We have discussed the importance of lead top localization and presented a detailed description on the methodologies that can be used to precisely segment and localize THT lead top inside the solder joint. Findings: It could be observed that the precise localization of THT lead top makes the soldering quality assurance process more accurate. A combination of template matching algorithms and colour model transformation provide the most accurate outcome in localizing the component lead top inside solder joint, according to the analysis carried out in this paper. Research limitations/implications: When the component lead top is fully covered by the soldering, the implemented methodologies will not be able to identify the actual location of it. In such a case, if the segmented and detected lead top locations are different, a decision is made based on the direction in which the solder iron tip touches the solder pad. Practical implications: The methodologies presented in this paper can be effectively used to have a precise localization of component lead top inside the solder joint. The precise identification of component lead top leads to have a very precise quality assurance capability to the implemented AOI system. Originality/value: This research proposes a novel approach to identify soldering defects of THT solder joints in a much efficient way based on the component lead top. The value of this paper is quite high, since we have taken all the possibilities that may appear on a solder joint in a practical environment.

2

Methods of manipulation and image acquisition of natural products on the example of cereal grains

Lampa P., Mrzygłód M., Reiner J.

Control and Cybernetics

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2016

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Vol. 45, no. 3

339--353

EN

Due to growing requirements concerning quality of products in food industry, it becomes important to introduce new, eﬃcient, objective and repeatable automated methods of quality inspection. Agricultural products, such as cereal grains, are particularly diﬃcult for automated inspection. This paper presents the results of experimental studies on the development of automated methods of manipulation and image acquisition of cereals, which can be used in machine vision systems for quality evaluation. Experimental studies were carried out on samples of brewing barley. The proof-of-concept evaluation of several methods was performed, on the basis of which the solution was chosen, based on the interaction of the screw and vibration feeders and bilateral image acquisition on moving transparent surface.

3

Model of a computer support for the design of AOI systems aimed at the detection of surface defects

Wójcicki T.

Diagnostyka

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2013

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Vol. 14, No. 3

35--40

EN

The article presents an original model supporting the design of AOI systems aimed at the detection of surface defects. The analysis of the state of the art shows that the problem of the design of automated systems employing noninvasive measurement methods, including AOI methods, dedicated to specialist tasks connected with surface quality control, is actually a prospective future research direction, as it is directly connected with the need to speed up and rationalise the design processes. The research problem presented in the article was defined through the determination of the scope of automated tasks aimed at the support of the design of AOI systems and methods for their execution. The research method consisted in the analysis of the available numerical methods and computer simulations enabling the selection of the solution facilitating the effectiveness of the decision-making process.

PL

Artykuł przedstawia autorski model wspomagania projektowania systemów AOI przeznaczonych do detekcji wad powierzchniowych. Analiza stanu wiedzy wskazuje, że problematyka projektowania zautomatyzowanych systemów wykorzystujących nieinwazyjne metody pomiarowe, w tym metody AOI, dedykowanych do specjalizowanych zadań związanych z kontrolą jakości powierzchni jest perspektywicznym kierunkiem w rozwoju badań naukowych, co spowodowane jest koniecznością przyśpieszenia i jakościowego usprawnienia procesów projektowania. Problem badawczy podejmowany w artykule określony został poprzez ustalenie zakresu zautomatyzowanych działań, których celem jest wspomaganie prac projektowych nad systemami AOI oraz metod przeznaczonych do ich realizacji. Metoda badawcza polegała na przeprowadzeniu analizy dostępnych metod numerycznych, oraz symulacji komputerowych w celu wyłonienia rozwiązania, umożliwiającego skuteczne wspomaganie procesów decyzyjnych.

4

Research results transformation in the process of innovation development illustrated by the example of automatic optical inspection

Giesko T., Trzos M.

Scientific Problems of Machines Operation and Maintenance

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2008

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Vol. 43, nr 3

61-74

EN

The paper presents the chosen aspects of the innovative solutions that have been worked out within the Multi-Year Programme "Development of innovativeness systems of manufacturing and maintenance 2004-2008." Most of the tasks that were qualified for the programme concern incremental innovation. One task, as the example of a direct transformation of the scientific research into innovations for economy, is described. The discussion was concentrated on the implementation of the method of automatic optical inspection (AOI) for a quality inspection in production. The specific features of AOI methods were discussed in relation to an incremental innovation. The analysis enables the identification of the crucial factors influencing the successive stages of the innovation development and consequently determining project success. The final effect of the project realisation, namely quality changes in production as a result of the incremental innovation development and implementation, was presented.

PL

W artykule przedstawiono aspekty związane z aplikacją rozwiązania innowacyjnego opracowanego w ramach Programu Wieloletniego „Doskonalenie systemów innowacyjności w produkcji i eksploatacji w latach 2004-2008". Większość zadań zakwalifikowanych do realizacji w ramach programu obejmowała opracowanie innowacji przyrostowej. W artykule przedstawiono efekty jednego z tych zadań jako przykład bezpośredniej transformacji wyników badań naukowych do gospodarki. Przeprowadzono dyskusję zastosowania metod automatycznej optycznej inspekcji (AOI) w systemach kontroli jakości w produkcji. Przeprowadzone badania umożliwiły identyfikację kluczowych czynników oddziałujących na kolejne etapy procesu rozwoju innowacji i w konsekwencji warunkujących sukces projektu. Przedstawiono jakościowe zmiany w procesie produkcji wyrobów w efekcie wdrożenia innowacji przyrostowej.

5

Automated production line for SMT manufacture

Demianiuk M., Miecielica M.

Elektronika : konstrukcje, technologie, zastosowania

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2004

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Vol. 45, nr 8-9

158-161

EN

The topic of the presentation is fully automatic production line designed for medium-series PCBs production. Represented basic technological SMT information and present technical solution.

PL

Tematem prezentacji jest automatyczna linia technologiczna zaprojektowana do produkcji średnioseryjnej płytek obwodów drukowanych. Przedstawione są podstawowe zagadnienia technologiczne, a także obecnie stosowane rozwiązania techniczne.