Wyniki wyszukiwania - BazTech

Ograniczanie wyników

1 Archives of Metallurgy and Materials

1 2005

Znaleziono wyników: 1

Liczba wyników na stronie

Wyniki wyszukiwania

Wyszukiwano:
w słowach kluczowych: Sn-Ag-Cu-Bi

Sortuj według:

Ogranicz wyniki do:

Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials

Kisiel R., Gąsior W., Moser Z., Pstruś J., Bukat K., Sitek J.

Archives of Metallurgy and Materials

2005

Vol. 50, iss. 4

1065-1071

The electrical resistivity and the tensile strength of two near ternary eutectic Sn-Ag-Cu and four solder alloys close to ternary eutectic Sn-Ag-Cu with different Bi content as well as eight Sn- Ag-Cu-Bi with different Sb content in the form of wires were investigated. The four-probe technique was used for electrical parameters measurements. Equipment of the author’s own construction for the tensile strength measurement was applied. It was found that the additions of Bi and Sb to Sn-Ag-Cu near eutectic alloys increase the resistivity and the tensile strength and that the reistivity of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb alloys is comparable with those of Pb-Sn solders for the bismuth and antimony content of about 3 atomic percent.