In order to study the interface microstructure and formation mechanism of nickel (Ni) foil/steel Q235 (Ni/Q235) explosive composite plate, Ni/Q235 laminated composite was successfully prepared by explosive welding technology using Ni foil, Q235 steel plate as substrate and composite plate. respectively. The microstructure of the bonding interface was analyzed by SEM and EDS. The mechanical properties of the interface were tested by tensile tests. The explosive welding process was simulated by the smooth particle fluid dynamics (Smoothed Particle Hydrodynamics, SPH) numerical simulation method. The results showed that the interface of the Ni/Q235 explosive composite plate had regular wave-like bonding, and there were no defects, such as unbonding and local melting at the bonding interface. The tensile strength of the tensile specimen reached 623 MPa, and the Ni layer and the Q235 layer on either side of the tensile specimen fracture exhibited a mainly plastic fracture. The numerical simulation results were in good agreement with the experimental results, which can provide theoretical support for the study of the explosive welding preparation of Ni/Q235 double-layer composite plate and the bonding mechanism of its connection interface.
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Platinum/titanium (Pt/Ti) bimetal composite is of utmost interest to the electrochemical industry for its superior functionality. Here, an improved explosive welding (EW) technology was introduced to join Pt foil and Ti sheet, and the microstructure evolution of the achieved Pt/Ti joint as well as the thermodynamic behaviors during the EW process was systematically investigated by various microscopic observations and smoothed particles hydrodynamics (SPH) simulation. It was found that the Pt/Ti EW interface was featured by a straight metallurgical reaction layer with a width of ~ 30 μm, and its formation mechanism was related to localized melting followed by intense mechanical mixing of participant metals. In the reaction layer, both elements of Pt and Ti were detected, and the average phase was determined to be Pt0.69Fe0.31. The EBSD analyses revealed a remarkable grain structure change near the interface, such as grain orientation deflection in Pt matrix, heat-induced grain growth in Ti matrix, and the formation of extra fine nanograins in the reaction layer. The SPH simulation well captured the morphology features of the Pt/Ti interface, and quantificationally revealed the extreme thermodynamic states of high heat of ~ 2000 K, high pressure of ~ 5 GPa, and large strain of ~ 3 during the EW process. Finally, the nanoindentation results revealed inhomogenous mechanical behaviors near the bonding interface.
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