Preferencje help
Widoczny [Schowaj] Abstrakt
Liczba wyników

Znaleziono wyników: 2

Liczba wyników na stronie
first rewind previous Strona / 1 next fast forward last
Wyniki wyszukiwania
Wyszukiwano:
w słowach kluczowych:  DIC technique
help Sortuj według:

help Ogranicz wyniki do:
first rewind previous Strona / 1 next fast forward last
EN
This study aimed to develop a knowledge about material parameters identification of the foam core and numerical modelling of the sandwich panels to accurately predict the behaviour of this kind of structures. The polyisocyanurate foam (PIR) with low density used in sandwich panels dedicated to civil engineering is examined in the paper. A series of experiments (tensile, compression and bending tests) were carried out to identify its mechanical parameters. To determine the heterogeneity of analysed foam a Digital Image Correlation (DIC) technique, named Aramis, is applied in the paper. The results obtained from FE analyses are compared with the experimental results on full-size plates carried out by the author and proper conclusions are drawn.
2
EN
The monitoring of structures has undergone important advances with the improvements of digital cameras available on the market. Thus, the Digital Image Correlation (DIC) technique has become a viable way of studying engineering problems. Recently it has been used in the debonding failure process between the reinforcement and the substrate. The methods or methodologies that should be followed to obtain the results associated to the debonding phenomenon using the DIC technique need to be better understood and studies on this topic are scarce. The present work therefore proposes a new and inexpensive method to monitor the interfacial behaviour between a reinforcement material and a substrate by combining the use of the DIC technique and a simplified nonlinear bond-slip model. For the validation of the proposed method, a series of single-lap shear tests with a sufficient long bond length carried out by the authors are used. Based on the slip distribution obtained from the DIC technique, it was found that a third-degree polynomial function can be used to approximate the interfacial bond-slip curve of the joint. The validation of the model is made with several analytical solutions using the proposed bond-slip model.
first rewind previous Strona / 1 next fast forward last
JavaScript jest wyłączony w Twojej przeglądarce internetowej. Włącz go, a następnie odśwież stronę, aby móc w pełni z niej korzystać.