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Analysis of the strengthening and recrystallization of electrolytic copper (Cu-ETP) and oxygen free copper (Cu-OF)

Zasadzińska Małgorzata, Knych Tadeusz, Strzępek Paweł, Jurkiewicz Bartosz, Franczak Krystian

Archives of Civil and Mechanical Engineering

2019

Vol. 19, no. 1

186--193

The research paper studies the strengthening and the kinetics of recrystallization of ETP copper and OF copper. This research covers a wide scope of strain hardening specific for the manufacturing of microwires (true strain of the order of 5) and the range of temperatures and times of the recrystallization process referring to the real life conditions occurring in advanced technologies of microwires’ manufacturing. As a result of the performed tests, it was established that the recrystallization temperature of ETP copper is lower than the recrystallization temperature of OF copper regardless of the recrystallization time as the recrystallisation effect can be achieved after about 10–30 s regardless of the copper grade.