Deposition of the metallic multilayers is a part of the scientific program on the chemical reaction leading to intermetallic compound formation. This reaction is known as self propagation high temperature synthesis (SHS). The key problem in this investigation is to produce the metallic multilayer system with good repeatability of thin films thicknesses. Thin should be thin, parallel and with low volume of intermixing region between components. Computer control system for the pulsed (mid frequency MF) magnetron sputtering equipment dedicated for metallic multilayers deposition is presented in this paper. The rotation velocity of the sample holder and the gas inlet through membrane valves are the main parameters controlled by the system. Parameters of the magnetron gun power supply, sample temperature and technological gas pressure are registered. The process cards which define all process parameters are collected for each dedicated process type. All cards are collected in a process cards library which permits for full automatization of all operations. Software was written in a graphical LabVIEW environment.
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