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Improvement of the electron beam lithography contact pads fabrication process

Indykiewicz K., Paszkiewicz R., Paszkiewicz B.

Optica Applicata

2016

Vol. 46, nr 2

249--254

In the paper, the verification of using the electron beam lithography technique as a main lithography tool for device fabrication is presented. The results of conducted experiments allow us to minimize the exposition time of big areas and retain acceptable metallic structures resolution and designed distances for structures in the neighborhood of a few micrometers. Conducted statistical analysis allows us to define the significance of the selected factors influence on the objectives of this study.

Chemical analysis of Ti/Al/Ni/Au ohmic contacts to AlGaN/GaN heterostructures

Macherzynski W, Indykiewicz K, Paszkiewicz B

Optica Applicata

2013

Vol. 43, nr 1

67--72

Ohmic contacts to AlGaN/GaN heterostructures, which have low contact resistance and a good surface morphology, are required for the development of high temperature, high power and high frequency electronic devices. The paper presents the investigation of a Ti/Al based Ti/Al/Ni/Au ohmic contact to AlGaN/GaN heterostructures. Multilayer metallization of Ti/Al/Ni/Au was evaporated by an electron gun (titanium and nickel layers) and a resistance heater (aluminum and gold layers). The contacts were annealed by rapid thermal annealing (RTA) system in a nitrogen ambient atmosphere over the temperature range from 715 to 865 °C. The time of the annealing process was 60 seconds. The chemical analysis, formation and deterioration mechanisms of Ti/Al/Ni/Au ohmic contacts to AlGaN/GaN heterostructures were studied as a function of the annealing process conditions by a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS).