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EN
Interfacial reactions between Ti/Al/Ni/Au metallization and GaN(cap)/AlGaN/GaN heterostructures at various annealing temperatures ranging from 715 to 865 °C were studied. Electrical current-voltage (I-V) characteristics, van der Pauw Hall mobility measurements and surface topography measurement with atomic force microscopy (AFM) were performed. The ohmic metallizations were annealed at various temperatures in a rapid thermal annealing system and the annealing time of 60 seconds was kept for all samples. To study the in?uence of the parameters of annealing process on the properties of the 2 dimensional electron gas (2DEG) the van der Pauw Hall mobility measurement was used. Interfacial reactions between the contact metals and heterostructures were analyzed through depth pro?les of secondary ion mass spectroscopy. It was observed that transition from nonlinear to linear I-V behavior occurred after the annealing at 805 °C. For the studied samples, the most promising results were obtained for the annealing temperature of 805 °C. This temperatue ensured not only low contact resistance but also made possible to preserve the 2DEG.
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EN
In this paper, the authors present a new attempt to the growth of AlGaAs structures with continuous change of aluminum content by metalorganic vapor phase epitaxy (MOVPE) technique. The new method of design of multistage growth process for functionally graded semiconductor materials (FGM) has been proposed. A comparison between classical single stage and multistage growth process has been carried out. The analysis of PVS, ECV and SIMS results of fabricated photodetector structures shows significant differences in composition profile of theoretically estimated and fabricated structures, and prove that the new conception of multistage process has more advantages over classical single stage procedure.
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