One of the main soldering technologies in the manufacture of electrotechnical devices is soft soldering. However, present-day environmental requirements do not admit using solders where one of the components is lead. Equivalent substitutive components of the solder can affect unfavourably the required properties of the soldered joint. In the present work, an example is given of metallographic analysis of a joint of a complex of electronic elements, which is soldered with an alloy based on Sn-Ag.