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2 2015

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Influence of aging time and temperature on diffusion of alloyed copper

Konieczny J., Rdzawski Z., Bańbura P., Preficz B.

Journal of Achievements in Materials and Manufacturing Engineering

2015

Vol. 73, nr 1

27--35

Purpose: The aim of this study is to determine the impact of aging time and temperature on the diffusion process of alloying elements inside alloyed copper CuCr0,7, CuFe2 and CuTi4. Design/methodology/approach: It was assumed the activation energy for diffusion of small interstitial atoms is smaller than for large substitute atoms. To determine the influence of aging time and temperature on diffusion of alloying elements in binary copper-based alloys CuCr0,7, CuFe2 and CuTi4 it has been necessary to develop a suitable mathematical model. It has been shown that with the increase of time t, the diffusion pathway L is increased, but the impact of time is not as large as the effect forced by altering temperature. In general, multiple increase of time is equivalent to increasing the temperature by a few degrees. Findings: The model should be used to estimate the average atom pathway of chromium, iron or titanium in copper matrix, caused by diffusion, and the diffusion path into the grain boundary without adsorption as a function of time and temperature aging Research limitations/implications: The model should be used to calculate the influence of temperature and time of aging on the atoms diffusion pathway of the alloying elements in the selected alloyed copper types. Practical implications: The results allow to calculate the average atom pathway L (with reasonable error level) for which the diffused atoms achieve the amount of free energy required to overcome the energetic barrier, on the basis of a combination of heat treatment parameters. Originality/value: This paper presents the impact of the aging temperature on diffusion in the alloyed copper CuCr0.7, CuFe2 and CuTi4.

“Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety” – the European Project Concerning the Main Automotive and Transport Application Domains

Kadlec J., Kuchta R., Novotny R., Hajduga A., Sekrecki M., Roszczyk P., Dybowski J., Kalbarczyk J., Zieliński W., Bańbura P., Burliński R.

Archiwum Motoryzacji

2015

Vol. 69, no. 3

31--64

The overall objective of the IDEAS project is to develop advanced packaging for power supply components and new generation memory systems applicable to Electric and ICE propelled vehicles, with paying attention to considering also the aspects that have not been addressed yet in the running ENIAC and ARTEMIS Automotive projects. A major challenge related to electronic devices in the automotive applications is the reliability of power supply systems which must be capable to assure the functionality of subsystems in all operating conditions, inclusive of ageing. The control systems, which rely on multicore microcontrollers and complex software architectures, require increasingly stringent constraints from the memory devices which need to be designed for very high bandwidth, speed and reliability. In the following thesis, a few aspects of the IDEAS project will be presented: a review of important factors that affect the reliability and life-cycle endurance of NAND flash memories, multispeed gear application in electric drives and its influence on the energy efficiency. The problem of electromagnetic compatibility of electronic devices will also be dealt with in the paper