Wyniki wyszukiwania - BazTech

1

Uwarunkowania tworzenia międzynarodowych sił zbrojnych do udziału w operacjach

Przekwas A.

Zeszyty Naukowe AON

|

2008

|

nr 1(70)A Numer specjalny

181-194

2

Virtual prototyping for thermal management for advanced electronics packaging

Przekwas A.

Electron Technology

|

1999

|

Vol. 32, No. 3

209-214

EN

Emerging mixed technology multi-chip packages integate several active and passive devices in a small footprint single substrate and are driven at ever increasing frequencies and operate at high power densities. Fabrication and design of these devices heavily relies on trial and error tests as no reliable mixed technology packaging CAD tools are currently avaible. This paper presents a new concept of Virtual Prototyping of electronics packaging and demonstrates it on the thermal management of microelectronic devices/packages/systems. Geometric modelling and solution adaptive grid generation is shown to play a pivotal role in rapid prototyping of advanced packages. A novel concept of multi-scale physical design is also presented and illustrated on concurrent electro-thermo-mechanical design of microelectronics at several levels spanning IC-level of a devices, die level, to package, board all the way up to entire system level design. The paper also expolores new ideas of multi-disciplinary design, so essential for mixed systems, involving both fabrication process (molding, curing, underfilling, reflow) and physical design (thermal, mechanical, electric, optical, electromagnetic,etc.).

3

3D simulation of thermal phenomena in arrays of vertical-clavity surface-emitting laser (VCSELs)

Turowski M., Yu E., Przekwas A., Nakwaski W., Osiński M.

Electron Technology

|

1999

|

Vol. 32, No. 3

220-226

EN

Two-dimensional arrays of vertical-cavity surface-emitting lasers (VCSELs) are very promising for use in parallel optical information processing, optical computing, high-speed and high-bandwidth free-space optical interconnects, and fibre-optic communications. However, one of the biggest problem is thermal behaviour of VCSELs, seriously limiting massive integration into 2D arrays. The paper presents an integrated sofware package for three-dimensional simulation and analysis of VCSEL arrays, allowing to investigate thier thermal, electrical and optical behaviour, as well as thermal crosstalk. Unique features of the presented softwere include full 3D thermal simulation of semiconductor laser array in package, coupled with self-consistent electro-thermo-optical model of VCSEL on a device level. Temperature dependencies of critical device and material properties are included, as well as multiple heat generation mechanisms. Computation results showing effects of spacing on lasing performance are presented. Degraded laser performance has been found due to the thermal crosstalk, which becomes more important for increased sizes and desities of laser arrays.