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Tytuł artykułu

Capacitance-voltage and Auger chemical profile studies on AlGaN/GaN structures passivated by SiO2/Si3N4 and SiNx /Si3N4 bilayers.

Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
AlGaN/GaN heterostructures passivated by SiO2/Si3N4 and SiNx/Si3N4 bilayers were characterized electrically by capacitance-voltage measurements and chemically by Auger microscopy chemical in-depth profiling. The 2-dimensional electron gas density was estimated from C-V curves and the electronic quality of the bilayers was evaluated from C-V hysteresis. Detailed variations of Auger peaks, in particular for oxygen, silicon, nitrogen, and carbon, versus argon ion sputtering time were registered. The electronic properties of these two structures were compared with each other and to their chemistry.
Czasopismo
Rocznik
Strony
327--334
Opis fizyczny
Bibliogr. 25 poz.
Twórcy
autor
autor
autor
autor
autor
  • Department of Applied Physics, Institute of Physics, Silesian University of Technology, Bolesława Krzywoustego 2, 44-100 Gliwice, Poland
Bibliografia
  • [1] SAITO W., TAKADA Y., KURAGUCHI M., TSUDA K., OMURA I., Recessed-gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications, IEEE Transactions on Electron Devices 53(2), 2006, pp. 356–62.
  • [2] BERNAT J., JAVORKA P., MARSO M., KORDOS P., Conductivity and Hall effect measurements on intentionally undoped and doped AlGaN/GaN heterostructures before and after passivation, Applied Physics Letters 83(26), 2003, pp. 5455–7.
  • [3] MAEDA N., HIROKI M., WATANABE N., ODA Y., YOKOYAMA H., YAGI T., MAKIMOTO T., ENOKI T., KOBAYASHI T., Systematic study of insulator deposition effect (Si3N4, SiO2, AlN, and Al2O3 ) on electrical properties in AlGaN/GaN heterostructures, Japanese Journal of Applied Physics, Part 1 46(2), 2007, pp. 547–54.
  • [4] KHAN M.A., HU X., SUMIN G., LUNEV A., YANG J., GASKA R., SHUR M.S., AlGaN/GaN metal oxide semiconductor heterostructure field effect transistor, IEEE Electron Device Letters 21(2), 2000, pp. 63–5.
  • [5] TARAKJI A., HU X., KOUDYMOV A., SIMIN G., YANG J., KHAN M.A., SHUR M.S., GASKA R., DC and microwave performance of a GaN/AlGaN MOSHFET under high temperature stress, Solid State Electronics 46(8), 2002, pp. 1211–4.
  • [6] TAN W.S., HOUSTON P.A., HILL G., AIREY R.J., PARBOOK P.J., Electrical characteristics of AlGaN/GaN metal-insulator-semiconductor heterostructure field-effect transistors on sapphire substrates, Journal of Electronic Materials 32(5), 2003, pp. 350–4.
  • [7] WANG C.K., CHUANG R.W., CHANG S.J., SU Y.K., WEI S.C., LIN T.K., KO T.K., CHIOU Y.Z., TANG J.J., High temperature and high frequency characteristics of AlGaN/GaN MOS-HFETs with photochemical vapor deposition SiO2 layer, Materials Science and Engineering B: Solid State Materials for Advanced Technology 119(1), 2005, pp. 25–8.
  • [8] WANG C., MAEDA N., HIROKI M., KOBAYASHI T., ENOKI T., High temperature characteristics of insulated-gate AlGaN/GaN heterostructure field-effect transistors with ultrathin Al2O3/Si3N4 bilayer, Japanese Journal of Applied Physics, Part 1 44(11), 2005, pp. 7889–91.
  • [9] MOSCA R., GOMBIA E., PASSASEO A., TASCO V., PERONI M., ROMANINI P., DLTS characterization of silicon nitride passivated AlGaN/GaN heterostructures, Superlattices and Microstructures 36(4–6), 2004, pp. 425–33.
  • [10] KORDOS P., KUDELA P., GREGUSOVA D., DONOVAL D., The effect of passivation on the performance of AlGaN/GaN heterostructure field-effect transistors, Semiconductor Science and Technology 21(12), 2006, pp. 1592–6.
  • [11] VETURY R., ZHANG N.Q., KELLER S., MISHRA U.K., The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs, IEEE Transactions on Electron Devices 48(3), 2001, pp. 560–6.
  • [12] KOTANI J., KASAI S., HASHIZUME T., HASEGAWA H., Lateral tunneling injection and peripheral dynamic charging in nanometerscale Schottky gates on AlGaN/GaN hetrosturucture transistors, Journal of Vacuum Science and Technology B 23(4), 2005, pp. 1799–807; KOTANI J., KANEKO M., HASEGAWA H., HASHIZUME T., Large reduction of leakage currents in AlGaN Schottky diodes by a surface control process and its mechanism, Journal of Vacuum Science and Technology B 24(4), 2006, pp. 2148–55.
  • [13] BARDWELL J.A., HAFFOUZ S., MCKINNON W.R., STOREY C., TANG H., SPROULE G.I., ROTH D., WANG R., The effect of surface cleaning on current collapse in AlGaN/GaN HEMTs, Electrochemical and Solid State Letters 10(2), 2007, pp. H46–9.
  • [14] ELSASS C.R., MATES T., HEYING B., POBLENZ C., FINI P., PETROFF P.M., DENBAARS S.P., SPECK J.S., Effects of growth conditions on the incorporation of oxygen in AlGaN layers grown by plasma assisted molecular beam epitaxy, Applied Physics Letters 77(20), 2000, pp. 3167–9.
  • [15] BOUGRIOUA Z., MOERMAN I., SHARMA N., WALLIS R.H., CHEYNS J., JACOBS K., THRUSH E.J., CONSIDINE L., BEANLAND R., FARVACQUE J.-L., HUMPHREYS C., Material optimisation for AlGaN/GaN HFET applications, Journal of Crystal Growth 230(3–4), 2001, pp. 573–8.
  • [16] BRADLEY S.T., GOSS S.H., HWANG J., SCHAFF W.J., BRILLSON L.J., Pre-metallization processing effects on Schottky contacts to AlGaN/GaN heterostructures, Journal of Applied Physics 97(8), 2005, pp. 084502/1–9.
  • [17] XU T., THOMIDIS C., FRIEL I., MOUSTAKAS T.D., Growth and silicon doping of AlGaN films in the entire alloy composition by molecular beam epitaxy, Physica Status Solidi C 2(7), 2005, pp. 2220–3.
  • [18] MOE C.G., SCHMIDT M.C., MASUI H., CHAKRABORTY A., VAMPOLA K., NEWMAN S., MORAN B., SHEN L., MATES T., KELLER S., DENBAARS S.P., EMERSON D., Optimized doping and contact scheme for low-voltage 275-nm deep ultraviolet LEDs, Journal of Electronic Materials 35(4), 2006, pp. 750–3.
  • [19] RAN JUNXUE, WANG XIAOLIANG, HU GUOXIN, LI JIANPING, WANG JUNXI, WANG CUIMEI, ZENG YIPING, LI JINMIN, The difference of Si doping efficiency in GaN and AlGaN in GaN-based HBT structure, Physica Status Solidi C 3(3), 2006, pp. 490–3.
  • [20] LIU Q.Z., YU L.S., LAU S.S., REDWING J.M., PERKINS N.R., KUECH T.F., Thermally stable PtSi Schottky contact on n-GaN, Applied Physics Letters 70(10), 1997, pp. 1275–7.
  • [21] MILLER E.J., DANG X.Z., WIEDER H.H., ASBECK P.M., YU E.T., SULLIVAN G.J., REDWING J.M., Trap characterization by gate-drain conductance and capacitance dispersion studies of an AlGaN/GaN heterostructure field-effect transistor, Journal of Applied Physics 87(11), 2000, pp. 8070–3.
  • [22] LIN Z., LU W., LEE J., LIU D., FLYNN J.S., BRANDES G.R., Barrier heights of Schottky contacts on strained AlGaN/GaN heterostructures: Determination and effect of metal work functions, Applied Physics Letters 82(24), 2003, pp. 4364–6.
  • [23] GUMMEL H.K., A self-consistent iterative scheme for one-dimensional steady-state transistor calculations, IEEE Transactions on Electron Devices 11(10), 1964, pp. 455–65.
  • [24] MICZEK M., KANEKO M., HASHIZUME T., High-temperature C-V and I-V characterization of MIS and Schottky diodes on AlGaN/GaN heterostructure, International Workshop on Nitride Semiconductors, Kyoto 2006, Technical Digest, p. 286; MICZEK M., MIZUE C., HASHIZUME T., ADAMOWICZ B., Effects of interface states and temperature on the C-V behavior of metal/insulator/ AlGaN/GaN heterostructure capacitors, Journal of Applied Physics (to be published).
  • [25] COOPER J.A., Advances in SiC MOS technology, Physica Status Solidi A 162(1), 1997, pp. 305–20.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BPW6-0011-0001
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