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Analysis of the strengthening and recrystallization of electrolytic copper (Cu-ETP) and oxygen free copper (Cu-OF)

Wybrane pełne teksty z tego czasopisma
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Języki publikacji
EN
Abstrakty
EN
The research paper studies the strengthening and the kinetics of recrystallization of ETP copper and OF copper. This research covers a wide scope of strain hardening specific for the manufacturing of microwires (true strain of the order of 5) and the range of temperatures and times of the recrystallization process referring to the real life conditions occurring in advanced technologies of microwires’ manufacturing. As a result of the performed tests, it was established that the recrystallization temperature of ETP copper is lower than the recrystallization temperature of OF copper regardless of the recrystallization time as the recrystallisation effect can be achieved after about 10–30 s regardless of the copper grade.
Rocznik
Strony
186--193
Opis fizyczny
Bibliogr. 17 poz., rys., tab., wykr.
Twórcy
  • AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Krakow, Poland
  • AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Krakow, Poland
  • AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Krakow, Poland
  • AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Krakow, Poland
  • AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Krakow, Poland
Bibliografia
  • [1] Y.V.R.K. Prasad, K.P. Rao, Kinetics of high-temperature deformation of polycrystalline OFHC copper and the role of dislocation core diffusion, Philos. Mag. 84 (28) (2004) 3039–3050.
  • [2] G. Benchabane, Z. Boumerzoug, T. Gloriant, I. Thibon, Microstructural characterization and recrystallization kinetics of cold rolled copper, Physica B 406 (2011) 1973–1976.
  • [3] E. Woldt, D. Juul Jensen, Recrystallization techniques kinetics in copper: comparison between, Metall. Mater. Trans. A 26A (1995) 1717–1724.
  • [4] E. Woldt, New kinetic model for primary recrystallizationof pure metals, Metall. Mater. Trans. 32 (2001) 2465–2473.
  • [5] V. Erukhimovitch, J. Baram, Modelling recrystallization kinetics, Mater. Sci. Eng. A 214 (1996) 78–83.
  • [6] R. Sandstrom, R. Lagneborg, A model for static recrystallization after hot deformation, Acta Metall. 28 (1975) 481–488.
  • [7] H. Fei-Yi, L. Truan-Sheng, C. Li-Hui, W. Yuan-Tin, Recrystallization and fracture characteristics of thin copper wire, J. Mater. Sci. 42 (2007) 5476–5482.
  • [8] L. Błaż, P. Kwapisiński, Simple matematical model for prediction of recrystallization in copper, Arch. Metall. Mater. 54 (1) (2009) 161–170.
  • [9] M. Walkowicz, AGH-University of Science and Technology, Faculty of Non-Ferrous Metals, 2012 PhD Thesis – in polish.
  • [10] S. Fujiwara, K. Abiko, Ductility of ultra high purity copper, J. Phys. III 5 (1995), C7-275-300.
  • [11] J. Schamp, B. Verlinden, J. Van Humbeeck, Primary recrystallization and grain growth of tough pitch copper wire, J. Phys. IV 5 (1995), C3-273-278.
  • [12] H. Pops, Nonferous Wire handbook, The Wire Association International (3) Principles and practice, 1995.
  • [13] M. Martinez, A. Fernandez, M. Segarra, H. Xuriguera, F. Espiell, N. Ferrer, Comparative study of electrical and mechanical properties of fire-refined and electrolytically refined cold-drawn copper wires, J. Mater. Sci. 42 (2007) 7745–7749.
  • [14] D. Markovich, D. Guskovich, A. Llich, Effect of stresses In annealing a on its technological properties copper wire, Metal Sci. Heat Treat. 39 (1997) 127–129.
  • [15] M. Walkowicz, P. Osuch, A. Mamala, M. Zasadzińska, T. Knych, Selected aspects of cold-working process of ETP and OF copper wires and microwires, Hutnik Wiadomości Hutnicze 84 (1) (2017) 79–81.
  • [16] M. Zasadzińska, T. Knych, B. Smyrak, B. Jurkiewicz, M. Gniełczyk, S. Kordaszewski, J. Grzebinoga, Strengthening and susceptibility to annealing of copper and aluminium intended for electrical purposes, Web Sci.: WOS 000434346900044 (2017) 306–312.
  • [17] V.G. Garcia, J.M. Cabrera, J.M. Prado, Role of Cu2O during hot compression of 99.9% pure copper, Mater. Sci. Eng. A 488 (2008) 92–101.
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019)
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-fedb4f34-8c44-4bd5-8039-e66a9c37daa0
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