Design Optimization of QFP Structure for over 8Gbps Package Applications

• Autorzy: Sun H. , Cai Z. , Wu J. , Shi L. , Sun L.

Warianty tytułu

PL

Optymalizacja struktury QFP dla aplikacji o prędkości transmisji ponad 8Mbps

• Języki publikacji: EN

Abstrakty

EN

A 8Gbps packaging solution that uses low-cost quad flat pack (QFP) technology is presented. Since such a high speed is beyond the reach of traditional QFP package structure, a new design methodology with coplanar transmission line structure built into the lead frame has been developed. Due to the complexity level in QFP structure, each interconnect segment is accurately modelled in 3D model by utilizing the industry leading advance software tool, ANSYS HFSS. S-parameter, Time Domain Reflectometry (TDR) and Eye Diagram are used to help in understanding the contributing to the optimized QFP structure. The analysis results indicate that the optimized QFP structure can successfully achieve over 8Gbps single-end signal transmission.

PL

W artykule przedstawiono metodę zmiany struktury QFP na potrzeby przesyłu z prędkością 8Gbps. W celu analizy działania, stworzono model struktury o bardzo wysokiej precyzji, przy wykorzystaniu programów ANSYS HFSS. S-parameter, Time Domain Reflectometry (TDR) oraz Eye Diagram. Analiza wyników badań wykazuje, że wprowadzona optymalizacja pozwala na osiągnięcie założonej prędkości przesyłu danych.

Słowa kluczowe

EN

quad flat package; electromagnetic modelling; lumped equivalent circuit model; coplanar transmission line structure

PL

QFP; modelowanie elektromagnetyczne; model układu o parametrach skupionych

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Przegląd Elektrotechniczny
• Rocznik: 2013
• Tom: R. 89, nr 1b
• Strony: 284--289
• Opis fizyczny: Bibliogr. 16 poz., rys., tab., wykr.

Twórcy

autor

Sun H.

• National ASIC System Engineering Research Center, Southeast University, Nanjing 210096 People’s Republic of China
• Jiangsu Provincial Key Lab of ASIC Design, Nantong University, Nantong 226019, People’s Republic of China

autor

Cai Z.

• National ASIC System Engineering Research Center, Southeast University, Nanjing 210096 People’s Republic of China

autor

Wu J.

• National ASIC System Engineering Research Center, Southeast University, Nanjing 210096 People’s Republic of China

autor

Shi L.

• National ASIC System Engineering Research Center, Southeast University, Nanjing 210096 People’s Republic of China

autor

Sun L.

• Jiangsu Provincial Key Lab of ASIC Design, Nantong University, Nantong 226019, People’s Republic of China

Bibliografia

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• [3] Lawrence Larson, Darryl Jessie, "Advances in RF Packaging Technologies for Next-Generation Wireless Communications Applications", IEEE Custom Integrated Circuits Conference, 2003, 323-330
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