Experimental investigation of single-phase microjet cooling of microelectronics

• Autorzy: Rusowicz A. , Leszczyński M. , Grzebielec A. , Laskowski R.

Identyfikatory

DOI

10.1515/aoter-2015-0026

• Języki publikacji: EN

Abstrakty

EN

Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second). While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

Słowa kluczowe

EN

cooling; heat transfer; microjets; microprocessor

PL

chłodzenie; wymiana ciepła; mikrojety; mikroprocesor

• Wydawca: Wydawnictwo Instytutu Maszyn Przepływowych PAN ; Komitet Termodynamiki i Spalania PAN
• Czasopismo: Archives of Thermodynamics
• Rocznik: 2015
• Tom: Vol. 36, no. 3
• Strony: 139--147
• Opis fizyczny: Bibliogr. 13 poz., rys.

Twórcy

autor

Rusowicz A.

• Institute of Heat Engineering, Warsaw University of Technology, Nowowiejska 21/25, 00-665 Warsaw, Poland

autor

Leszczyński M.

• Research and Development Centre of Research and Didactic Equipment COBRABiD Ltd., Jagielonska 55, 03-301 Warsaw, Poland

autor

Grzebielec A.

• Institute of Heat Engineering, Warsaw University of Technology, Nowowiejska 21/25, 00-665 Warsaw, Poland

autor

Laskowski R.

• Institute of Heat Engineering, Warsaw University of Technology, Nowowiejska 21/25, 00-665 Warsaw, Poland

Bibliografia

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