The effect of post-bond solution treatment and double aging on the microstructural evolution and mechanical properties of TLP-bonded IN718 joint

• Autorzy: Tarai U. K. , Pal Sukhomay , Robi P. S.

Identyfikatory

DOI

10.1007/s43452-023-00638-2

• Języki publikacji: EN

Abstrakty

EN

The effect of post-bond heat treatment on precipitation of different strengthening phases in transient liquid phase (TLP) bonded IN718 joint is carried out in this work. TLP bonding of IN718 super-alloy was carried out using commercial BNi-2 amorphous interlayer. The bond microstructure of the IN718 joint was analyzed by field emission scanning electron microscope. The bond microstructure showed three distinct zones: viz., base material zone, where δ-phase was observed in the grain boundaries; diffusion-affected zone (DAZ) consisting of extensive diffusion-induced boride precipitates and isothermal solidification zone where a single-phase γ solid solution exists along with a small amount of silicides. The effect of post-bond heat treatment on the microstructure and precipitates formed at different zones was investigated in detail. The phase formed during post-bond heat treatment was analyzed by field emission transmission electron microscope and X-RD. The mechanical properties of as-bonded and post-bond heat treatment samples were also investigated. The results showed that a comparatively more homogeneous microstructure was achieved in the post-bond heat-treated samples. Post-bond heat treatment resulted in decrease in the volume fraction of borides at the DAZ, increase in volume fraction of hardening precipitates (γ’’ and γ’), and breaking up of grain boundary borides and increase in the DAZ size. An increased in γ’’ + γ’ precipitate volume was beneficial to the improvement of mechanical properties of the joint. Tensile strength of 1124 MPa with an elongation percentage of 10.5% was obtained after the post-bond heat treatment.

Słowa kluczowe

EN

TLP bonding; IN718 alloy; heat treatment; tensile strength

PL

TLP; stop IN718; obróbka cieplna; wytrzymałość na rozciąganie

• Wydawca: Springer ; Wrocław University of Science and Technology
• Czasopismo: Archives of Civil and Mechanical Engineering
• Rocznik: 2023
• Tom: Vol. 23, no. 2
• Strony: art. no. e110, 2023
• Opis fizyczny: Bibliogr. 33 poz., rys., tab., wykr.

Twórcy

autor

Tarai U. K.

• Department of Mechanical Engineering, Indian Institute of Technology, Guwahati, Assam 781039, India

autor

Pal Sukhomay

• Department of Mechanical Engineering, Indian Institute of Technology, Guwahati, Assam 781039, India

• https://orcid.org/0000-0003-2640-9317

autor

Robi P. S.

• Department of Mechanical Engineering, Indian Institute of Technology, Guwahati, Assam 781039, India

Bibliografia

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Uwagi

PL

Opracowanie rekordu ze środków MNiSW, umowa nr SONP/SP/546092/2022 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2024).