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A camera for scanning objects in motion based on an integrated detection system working in on-chip TDI mode

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
The paper presents an X-ray camera for testing moving objects. A typical application of such cameras is scanning products on an industrial production line. Currently, the most popular device detecting radiation in this type of camera consists of a pixel line based on scintillator detectors. Unfortunately, increasing its resolution automatically involves reducing the pixel size and reducing the signal-to-noise ratio. This is where the time domain integration method comes in handy, increasing the resolution without degrading the signal-to-noise ratio. The camera presented in this paper is based on an application-specific integrated circuit dedicated to this purpose. The application-specific integrated circuit core is a pixel matrix operating in a single-photon counting mode. Its architecture was designed to implement the time domain integration method and construct high-resolution cameras with a large scanning area. The article also describes the hardware and software of the application-specific integrated circuit readout system.
Rocznik
Strony
art. no. e153243
Opis fizyczny
Bibliogr. 15 poz., rys., fot.
Twórcy
  • Department of Measurement and Electronics, AGH University of Krakow, al. Mickiewicza 30, 30-059 Kraków, Poland
Bibliografia
  • [1] Siewerdsen, J. H. et al. Empirical and theoretical investigation of the noise performance of indirect detection, active matrix flat-panel imagers (AMFPIs) for diagnostic radiology. Med. Phys. 24, 71-89 (1997). https://doi.org/10.1118/1.597919.
  • [2] Kraft, P. et al. Characterization and calibration of Pilatus detectors. IEEE Trans. Nucl. Sci. 56, 758-764 (2009). https://doi.org/10.1109/TNS.2008.2009448.
  • [3] Dinapoli, R. et al. A new family of pixel detectors for high frame rate X-ray applications. Nucl. Instrum. Methods Phys. Res. A: Accel. Spectrom. Detect. Assoc. Equip. 617, 384-386 (2010). https://doi.org/10.1016/j.nima.2009.10.043.
  • [4] Maj, P., Grybos, P., Kmon, P. & Szczygiel, R. 32k channel readout IC for single photon counting pixel detectors with 75 μm pitch, dead time of 85 ns, 9 e−rms offset spread and 2% rms gain spread. IEEE Trans. Nucl. Sci. 63, 1155-1161 (2016). https://doi.org/10.1109/TNS.2016.2523260.
  • [5] Ballabriga, R. et al. Review of hybrid pixel detector readout ASICs for spectroscopic X-ray imaging. J. Instrum. 11, P01007 (2016). https://doi.org/10.1088/1748-0221/11/01/P01007.
  • [6] Pangaud, P. et al. First Results of XPAD3, a New Photon Counting Chip for X-Ray CT-Scanner with Energy Discrimination. in IEEE Nuclear Science Symposium and Medical Imaging Conference NSS-MIC 14-18 (IEEE, 2007).
  • [7] Bellazini, R. et al. Chromatic X-ray imaging with a fine pitch CdTe sensor coupled to a large area photon counting pixel ASIC. J. Instrum. 8, C02028 (2013). https://doi.org/10.1088/1748-0221/8/02/C02028.
  • [8] Ballabriga, R. et al. The Medipix3RX: a high resolution, zero-dead time pixel detector readout chip allowing spectroscopic imaging. J. Instrum. 8, C02016 (2013). https://doi.org/10.1088/1748-0221/8/02/C02016.
  • [9] Grybos, P. Front-end Electronics for Multichannel Semiconductor Detector Systems. (Oficyna Wydawnica Politechniki Warszawskiej, 2010).
  • [10] McGregor, D. S. & Hermon, H. Room-temperature compound semiconductor radiation detectors. Nucl. Instrum. Methods Phys. Res. A: Accel. Spectrom. Detect. Assoc. Equip. 395, 101-124 (1997). https://doi.org/10.1016/S0168-9002(97)00620-7.
  • [11] Ovens, A. & Peacock, A. Compound semiconductor radiation detectors. Nucl. Instrum. Methods Phys. Res. A: Accel. Spectrom. Detect. Assoc. Equip. 531, 18-37 (2004). https://doi.org/10.1016/j.nima.2004.05.071.
  • [12] Locker, M. et al. Single photon counting X-Ray imaging with Si and CdTe single chip pixel detectors and multichip pixel modules. IEEE Trans. Nucl. Sci. 51, 1717-1723 (2004). https://doi.org/10.1109/TNS.2004.832610.
  • [13] Holdsworth, D. W., Gerson, R. K. & Fenster, A. A time-delay integration charge-coupled device camera for slot-scanned digital radiography. Med. Phys. 17, 876-886 (1990). https://doi.org/10.1118/1.596578.
  • [14] Zoladz, M., Grybos, P. & Szczygiel, R. X-ray imaging of moving objects using on-chip TDI and MDX methods with single photon counting CdTe hybrid pixel detector. J. Instrum. 16, C12014 (2021). https://doi.org/10.1088/1748-0221/16/12/C12014.
  • [15] Zoladz, M., Grybos, P. & Choręgiewicz, K. Test measurements of an ASIC for X-ray material discrimination by using on-chip time domain integration and a CdTe sensor. J. Instrum. 19, C03033 (2024). https://doi.org/10.1088/1748-0221/19/03/C03033.
Uwagi
1. Opracowanie rekordu ze środków MNiSW, umowa nr POPUL/SP/0154/2024/02 w ramach programu "Społeczna odpowiedzialność nauki II" - moduł: Popularyzacja nauki (2025).
2. The work was created thanks to a project co-financed by the National Center for Research and Development under the “Path for Mazovia” program, contract: “MAZOWSZE/0099/19”.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-fae8a170-138c-4f4a-8288-89524d62f943
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