Ultra-wide-angle Wireless Endoscope with a Backend-camera-controller Architecture

• Autorzy: Shim D. , Yi J.

Identyfikatory

DOI

10.1515/eletel-2017-0003

• Języki publikacji: EN

Abstrakty

EN

This paper presents a wireless endoscope with an ultra-wide FOV (Field of View) of 130° and HD resolution (1280x720 pixels). The proposed endoscope consists of a camera head, cable, camera controller, and wireless handle. The lens module with a 150° degrees AOV (Angle of View) is achieved using the plastic injection-molding process to reduce manufacturing costs. A serial CMOS image sensor using the MIPI (Mobile Industry Processor Interface) CSI-2 (Camera Serial Interface-2) interface physically separates the camera processor from the camera head. The camera head and the cable have a compact structure due to the BCC (Backend-Camera-Controller) architecture. The size of the camera head and the camera controller is 8x8x26 mm and 7x55 mm, respectively. The wireless handle supports a UWB (Ultra-Wide-Band) or a Wi-Fi communication to transmit video data. The UWB link supports a maximum data transfer rate of ~37 Mbps to transmit video data with a resolution of 1280x720 pixels at a frame rate of 30 fps in the MJPEG (Motion JPEG) format. Although the Wi-Fi link provides a lower data transfer rate (~8 Mbps Max.), it has the advantage of flexible interoperability with various mobile devices. The latency of the UWB link is measured to be ~0.1 sec. The Wi-Fi link has a larger latency (~0.5 sec) due to its lower data transfer rate. The proposed endoscope demonstrates the feasibility of a high-performance yet low-cost wireless endoscope using the BCC architecture. To the best of the author’s knowledge, the proposed endoscope has the largest FOV among all presently existing wireless endoscopes.

Słowa kluczowe

EN

wireless endoscope; ultra wide-angle; plastic lens; backend camera controller; serial image sensor; ultra wideband; Wi-Fi; latency

• Wydawca: Polish Academy of Sciences, Committee of Electronics and Telecommunication
• Czasopismo: International Journal of Electronics and Telecommunications
• Rocznik: 2017
• Tom: Vol. 63, No. 1
• Strony: 19--24
• Opis fizyczny: Bibliogr. 34 poz., fot., rys.

Twórcy

autor

Shim D.

• SeoulTech (Seoul National University of Science & Technology), Seoul, Korea

autor

Yi J.

• Haesung Optics Co., Ltd., Suwon, Korea

Bibliografia

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Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017).