A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

• Autorzy: Khoo S.-W. , Karuppanan S. , Tan C.-S.

Identyfikatory

DOI

10.1515/mms-2016-0028

• Języki publikacji: EN

Abstrakty

EN

Among the full-field optical measurement methods, the Digital Image Correlation (DIC) is one of the techniques which has been given particular attention. Technically, the DIC technique refers to a non-contact strain measurement method that mathematically compares the grey intensity changes of the images captured at two different states: before and after deformation. The measurement can be performed by numerically calculating the displacement of speckles which are deposited on the top of object’s surface. In this paper, the Two-Dimensional Digital Image Correlation (2D-DIC) is presented and its fundamental concepts are discussed. Next, the development of the 2D-DIC algorithms in the past 33 years is reviewed systematically. The improvement of 2DDIC algorithms is presented with respect to two distinct aspects: their computation efficiency and measurement accuracy. Furthermore, analysis of the 2D-DIC accuracy is included, followed by a review of the DIC applications for two-dimensional measurements.

Słowa kluczowe

EN

surface deformation; strain measurement; two-dimensional digital image correlation

• Wydawca: Komitet Metrologii i Aparatury Naukowej PAN
• Czasopismo: Metrology and Measurement Systems
• Rocznik: 2016
• Tom: Vol. 23, nr 3
• Strony: 461--480
• Opis fizyczny: Bibliogr. 118 poz., rys., wzory

Twórcy

autor

Khoo S.-W.

• Universiti Tunku Abdul Rahman, Jalan Universiti, Department of Industrial Engineering, Bandar Barat, 31900 Kampar, Perak, Malaysia
• Universiti Teknologi PETRONAS, Department of Mechanical Engineering, 32610 Bandar Seri Iskandar, Perak, Malaysia

autor

Karuppanan S.

• Universiti Teknologi PETRONAS, Department of Mechanical Engineering, 32610 Bandar Seri Iskandar, Perak, Malaysia

autor

Tan C.-S.

• Multimedia University, Jalan Multimedia, Faculty of Engineering, 63000 Cyberjaya, Selangor, Malaysia

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Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017).