The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

• Autorzy: Koncz-Horváth D. , Gergely G. , Gacsi Z.

Identyfikatory

DOI

10.1515/amm-2015-0150

Warianty tytułu

PL

Wpływ powstawania pustek na wiarygodność badań ED-XRF bezołowiowych złączy lutowanych rozpływowo

• Języki publikacji: EN

Abstrakty

EN

In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of reflow soldering (i.e. of electrical and electronic equipment) is necessary; and the practical implementation of this measurement is largely affected by the characteristics of the solder (i.e. the presence of voids and the inhomogeneity of the solder). Comparing the results of the above two coating methods, it was found that by chemical coating more voids were formed and the detected lead content was higher than for galvanic Sn. The standard deviation of Ag and Cu concentrations was mainly influenced by the appearance of large compounds in the second case, while with chemical coating, no large compounds were formed due to the elevated number of voids.

Słowa kluczowe

EN

EDXRF; lead-free; void; intermetallic; reflow

PL

EDXRF; złącze bezołowiowe; pustka lutownicza; lutowanie rozpływowe; cząstka międzymetaliczna

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2015
• Tom: Vol. 60, iss. 2B
• Strony: 1445--1448
• Opis fizyczny: Bibliogr. 19 poz., rys.

Twórcy

autor

Koncz-Horváth D.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc, Hungary

autor

Gergely G.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc, Hungary

autor

Gacsi Z.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc, Hungary

Bibliografia

• [1] N-C. Lee, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, Oxford 2002.
• [2] M. R. Harrison, J. H. Vincent, H. A. H. Steen, Sold. & Surf. M. Tech., 13, 3 (2001).
• [3] K. J. Puttlitz, K. A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, New York 2004.
• [4] E. H. Amalu, W. K. Lau, N. N. Ekere, R. S. Bhatti, S. Mallik, K. C. Otiaba, G. Takyi, J. Microel. Eng. 88 (2011).
• [5] M. Yunus, K. Srihari, J.M. Pitarresi, A. Primavera, J. Microel. Rel. 43 (2003).
• [6] D. Shangguan, Lead-Free Solder Interconnect Reliability, USA 2005.
• [7] K. Zeng, K. N. Tu, J. Mater. Sci. Eng. R 38 (2002).
• [8] A. Sharif, Y. C. Chan, R. A. Islam, Mat. Sci. and Eng. B 106 (2004).
• [9] M. A. Dudek, L. Hunter, S. Kranz, J. J. Williams, S. H. Lau, N. Chawla, J. Mat. Char. 61, 4 (2010).
• [10] P. Cusack, T. Perrett, J.Plast., Addit. and Comp. 8, 3 (2006).
• [11] S. Biligiri, J. Met. Finish. 105, 4 (2007).
• [12] F. Reilly, J. Met. Finish. 105, 10 (2007).
• [13] R. P. Alvarez, A. Markowicz, D. Wegrzynek, E. C. Cano, S. A. Bamford, D. H. Torres, J. X-Ray Spectr. 36 (2007).
• [14] J. Sherman, J. Spectrochim. Acta 7 (1955).
• [15] G. R. Lachance, R. J. Traill, Canadian J. Spect. 11 (1966).
• [16] M. Bos, J. A. M. Vrielink, J.Anal.Chim. Acta 373 (1998).
• [17] V. Rößiger, B. Nensel, Analyse von Schichtdicken mit Röntgenfluoreszenz, Jahrbuch Oberflächentechnik, Bad Saulgau 2004.
• [18] C. K. S. Alex, Y. C. Chan, IEEE Trans. on Comp., Pack., and Man. Tech. B 19, 3 (1996).
• [19] S. Ghosh, Z. Nowak, K. Lee, J.Acta Mater. 45, 6 (1997).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę.