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Properties of thin films of high-k oxides grown by atomic layer deposition at low temperature for electronic applications

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Języki publikacji
EN
Abstrakty
EN
Thin films of high-k oxides are presently used in semiconductor industry as gate dielectrics. In this work, we present the comparison of structural, morphological and electrical properties of binary and composite layers of high-k oxides that include hafnium dioxide (HfO2), aluminum oxide (Al2O3) and zirconium dioxide (ZrO2). We deposit thin films of high-k oxides using atomic layer deposition (ALD) and low growth temperature (60–240 °C). Optimal technological growth parameters were selected for the maximum smoothness, amorphous microstructure, low leakage current, high dielectric strength of dielectric thin films, required for gate applications. High quality of the layers is confirmed by their introduction to test electronic structures, such as thin film capacitors, transparent thin film capacitors and transparent thin film transistors. In the latter structure we use semiconductor layers of zinc oxide (ZnO) and insulating layers of high-k oxide grown by the ALD technique at low temperature (no more than 100 °C).
Czasopismo
Rocznik
Strony
17--25
Opis fizyczny
Bibliogr. 16 poz., rys., tab., wykr.
Twórcy
  • Institute of Physics, Polish Academy of Sciences, al. Lotników 32/46, 02-668 Warsaw, Poland
  • Institute of Physics, Polish Academy of Sciences, al. Lotników 32/46, 02-668 Warsaw, Poland
  • Institute of Physics, Polish Academy of Sciences, al. Lotników 32/46, 02-668 Warsaw, Poland
autor
  • Institute of Physics, Polish Academy of Sciences, al. Lotników 32/46, 02-668 Warsaw, Poland
  • Department of Mathematics and Natural Sciences, College of Science, Cardinal S. Wyszyński University, Dewajtis 5, 01-815 Warsaw, Poland
autor
  • Institute of Physics, Polish Academy of Sciences, al. Lotników 32/46, 02-668 Warsaw, Poland
Bibliografia
  • [1] WAGER J.F., Transparent electronics, Science 300(5623), 2003, pp. 1245–1246.
  • [2] WAGER J.F., KESZLER D.A., PRESLEY R.E., Transparent Electronics, Springer, New York, 2008.
  • [3] MASUDA S., KITAMURA K., OKUMURA Y., MIYATAKE S., TABATA H., KAWAI T., Transparent thin film transistors using ZnO as an active channel layer and their electrical properties, Journal of Applied Physics 93(3), 2003, pp. 1624–1630.
  • [4] HOFFMAN R.L., NORRIS B.J., WAGER J.F., ZnO-based transparent thin-film transistors, Applied Physics Letters 82(5), 2003, pp. 733–735.
  • [5] NOMURA K., OHTA H., UEDA K., KAMIYA T., HIRANO M., HOSONO H., Thin-film transistor fabricated in single-crystalline transparent oxide semiconductor, Science 300(5623), 2003, pp. 1269–1272.
  • [6] CARCIA P.F., MCLEAN R.S., REILLY M.H., NUNES G., Transparent ZnO thin-film transistor fabricated by rf magnetron sputtering, Applied Physics Letters 82(7), 2003, pp. 1117–1119.
  • [7] ROBERTSON J., High dielectric constant oxides, The European Physical Journal – Applied Physics 28(3), 2004, pp. 265–291.
  • [8] ROBERTSON J., High dielectric constant gate oxides for metal oxide Si transistors, Reports on Progress in Physics 69(2), 2006, pp. 327–396.
  • [9] ROBERTSON J., Band offsets of wide-band-gap oxides and implications for future electronic devices, Journal of Vacuum Science and Technology B 18(3), 2000, pp. 1785–1791.
  • [10] WILK G.D., WALLACE R.M., ANTHONY J.M., High-κ gate dielectrics: current status and materials properties considerations, Journal of Applied Physics 89(10), 2001, pp. 5243–5275.
  • [11] MOORE G.E., Cramming more components onto integrated circuits, Electronics 38(8), 1965, pp. 114–117.
  • [12] SHIH-HSIEN H. LO, BUCHANAN D.A., YUAN TAUR, WEN I. WANG, Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET’s, IEEE Electron Device Letters 18(5), 1997, pp. 209–211.
  • [13] SUNTOLA T., ANTSON J., Method for Producing Compound Thin Films, U.S. Patent 4,058,430, 1977.
  • [14] GIERAŁTOWSKA S., SZTENKIEL D., GUZIEWICZ E., GODLEWSKI M., ŁUKA G., WITKOWSKI B.S., WACHNICKI Ł., ŁUSAKOWSKA E., DIETL T., SAWICKI M., Properties and characterization of ALD grown dielectric oxides for MIS structures, Acta Physica Polonica A 119(), 2011, pp. 692–695.
  • [15] BIERCUK M.J., MONSMA D.J., MARCUS C.M., BECKER J.S., GORDON R.G., Low-temperature atomic-layer-deposition lift-off method for microelectronic and nanoelectronic applications, Applied Physics Letters 83(12), 2003, pp. 2405–2407.
  • [16] GIERALTOWSKA S., WACHNICKI L., WITKOWSKI B.S., GODLEWSKI M., GUZIEWICZ E., Atomic layer deposition grown composite dielectric oxides and ZnO for transparent electronic applications, Thin Solid Films 520(14), 2012, pp. 4694–4697.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-ea0554ac-e99c-4ab4-8715-04be6f0f984d
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