Improvement of the electron beam lithography contact pads fabrication process

• Autorzy: Indykiewicz K. , Paszkiewicz R. , Paszkiewicz B.

Identyfikatory

DOI

10.5277/oa160209

• Języki publikacji: EN

Abstrakty

EN

In the paper, the verification of using the electron beam lithography technique as a main lithography tool for device fabrication is presented. The results of conducted experiments allow us to minimize the exposition time of big areas and retain acceptable metallic structures resolution and designed distances for structures in the neighborhood of a few micrometers. Conducted statistical analysis allows us to define the significance of the selected factors influence on the objectives of this study.

Słowa kluczowe

EN

electron beam lithography; EBL; exposition of big areas; exposition time optimization

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Optica Applicata
• Rocznik: 2016
• Tom: Vol. 46, nr 2
• Strony: 249--254
• Opis fizyczny: Bibliogr. 4 poz., rys., tab.

Twórcy

autor

Indykiewicz K.

• Wrocław University of Science and Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11/17, 50-372 Wrocław, Poland

autor

Paszkiewicz R.

• Wrocław University of Science and Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11/17, 50-372 Wrocław, Poland

autor

Paszkiewicz B.

• Wrocław University of Science and Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11/17, 50-372 Wrocław, Poland

Bibliografia

• [1] WANG L.K., TAUR Y., MOY D., DENNARD R.H., CHIONG K., HOHN F., COANE P.J., EDENFELD A., CARBAUGH S., KENNEY D., SCHNUR S., 0.5 micron gate CMOS technology using e-beam/optical mix lithography, Symposium on VLSI Technology, Digest of Technical Papers, 1986, p. 13–14.
• [2] RAHMAN S.F.A., YUSOF N.A., HAMIDON M.N., ZAWAWI R.M., HASHIM U., Top-down fabrication of silicon nanowire sensor using electron beam and optical mixed lithography, 2014 IEEE International Conference on Semiconductor Electronics (ICSE), pp. 64–67.
• [3] SASAKI S., ITOH K., FUJII A., TOYAMA N., MOHRI H., HAYASHI N., Photomask process development for next generation lithography, Proceeding of SPIE 5853, 2005, pp. 277–288.
• [4] RAI-CHOUDHURY P. [Ed.], Handbook of Microlithography, Micromachining, and Microfabrication. Volume 1: Microlithography, SPIE Press Book, Bellingham, Washington, 1997, p. 158.

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę.