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In the present paper the quantitative relationship between the heat and mass transfer in the Aixtron VP508 hot wall CVD reactor and the epitaxial growth of silicon carbide is determined. The aim of this study was to estimate optimal process conditions for obtaining monocrystalline silicon carbide epi-layers with the most homogenous thickness. Since there are many parameters influencing reactions on the crystal area, such as temperature, pressure, gas flow and reactor geometry, it is difficult to design an optimal process. Detailed 3D modeling was used to gain insight into the process conditions, as it is problematic to experimentally determine the exact distribution of heat and mass transfer inside the reactor during epitaxial growth. Numerical simulations allow one to understand the process by calculating the heat and mass transfer distribution during the epitaxial growth of silicon carbide. The present approach was applied to enhance the performance of the Aixtron VP508 reactor.
Czasopismo
Rocznik
Tom
Strony
119--125
Opis fizyczny
Bibliogr. 15 poz., rys., tab., wykr.
Twórcy
autor
- Faculty of Materials Science Engineering, Warsaw University of Technology, Poland
autor
- Faculty of Materials Science Engineering, Warsaw University of Technology, Poland
autor
- Institute of Electronic Materials Technology, Warsaw, Poland
autor
- Faculty of Materials Science Engineering, Warsaw University of Technology, Poland
Bibliografia
- [1] Y. S. Park, Sic materials and devices, semiconductors and semimetals, Academic, San Diego 1998 52.
- [2] S. Lilov, Y. M. Tairov, V. Tsvetkov, Study of silicon carbide epitaxial growth kinetics in the sic-c system, Journal of Crystal Growth 46 (2) (1979) 269–273.
- [3] D. Teklinska, K. Kosciewicz, K. Grodecki, M. Tokarczyk, G. Kowalski, W. Strupinski, A. Olszyna, J. Baranowski, Epitaxial graphene perfection vs. sic substrate quality, Open Physics 9 (2) (2011) 446–453.
- [4] Y. Wang, R. Davis, Growth rate and surface microstructure in α (6h)–sic thin films grown by chemical vapor deposition, Journal of electronic materials 20 (7) (1991) 869–874.
- [5] X. Feng, Z. Chen, J. Ma, X. Zan, H. Pu, G. Lu, Epitaxial growth of cubic silicon carbide on silicon by sublimation method, Optical Materials 23 (1) (2003) 39–42.
- [6] P. M. Lofgren, C. Hallin, C.-Y. Gu, W. Ji, 3-d thermal and flow modeling of hot wall epitaxial chemical vapor deposition reactors, heated by induction, in: Materials Science Forum, Vol. 338, Trans Tech Publ, 2000, pp. 153–156.
- [7] P. Lofgren, W. Ji, C. Hallin, C.-Y. Gu, Modeling of silicon carbide epitaxial growth in hot-wall chemical vapor deposition processes, Journal of The Electrochemical Society 147 (1) (2000) 164–175.
- [8] R. Pawlowski, C. Theodoropoulos, A. Salinger, T. Mountziaris, H. Moffat, J. Shadid, E. Thrush, Fundamental models of the metalorganic vapor-phase epitaxy of gallium nitride and their use in reactor design, Journal of Crystal Growth 221 (1) (2000) 622–628.
- [9] M. Dauelsberg, H. Hardtdegen, L. Kadinski, A. Kaluza, P. Kaufmann, Modeling and experimental verification of deposition behavior during algaas growth: a comparison for the carrier gases n 2 and h 2, Journal of crystal growth 223 (1) (2001) 21–28.
- [10] H. Hardtdegen, A. Kaluza, D. Gauer, M. Ahe, M. Grimm, P. Kaufmann, L. Kadinski, On the influence of gas inlet configuration with respect to homogeneity in a horizontal single wafer movpe reactor, Journal of crystal growth 223 (1) (2001) 15–20.
- [11] C. S. Kim, J. Hong, J. Shim, B. J. Kim, H.-H. Kim, S. D. Yoo, W. S. Lee, Numerical and experimental study on metal organic vapor-phase epitaxy of ingan/ gan multi-quantum-wells, Journal of fluids engineering 130 (8) (2008) 081601.
- [12] M.Dauelsberg, L.Kandinski, Yu.N.Makarov, E.Woelk, G.Strauch, D.Schmitz, H.Juergensen, GaN-MOVPE: correlation between computer modelling and experimental data, Institute of Physics Conference Series Vol.142, 887 (1996).
- [13] D. Teklinska, K. Grodecki, I. Jozwik-Biała, P. Caban, A. Olszyna, W. Strupinski, The influence of pressure on growth of 3csic heteroepitaxial layers on silicon substrates, Journal of Crystal Growth 401 (2014) 542–546.
- [14] G. Zhou, S.-C. Yao, Effect of surface roughness on laminar liquid flow in micro-channels, Applied Thermal Engineering 31 (2) (2011) 228–234.
- [15] E. Yakovlev, R. Talalaev, Y. Makarov, Y. BS, W. WN, Deposit behavior of gan in aix 200/4 rf-s horizontal reactor, Journal of Crystal Growth 261 (2004) 182–189.
Typ dokumentu
Bibliografia
Identyfikator YADDA
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