Cooling of minimized surface-mount packages in power electronics applications

• Autorzy: Šír Michal , Feňo Ivan

Identyfikatory

DOI

10.15199/48.2020.11.31

Warianty tytułu

PL

Chłodzenie elementów elektronicznych przy minimalizacji ich wymiarów

• Języki publikacji: EN

Abstrakty

EN

With rise of GaN and SiC semiconductors in last few years, amount of available power semiconductors in minimized surface mount packages significantly increased. Together with rising pressure to increase power density of power conversion systems became effective design of cooling crucial. The aim of this article is to propose innovative methods of cooling of minimized surface mount packages, especially in application of power electronics. Article presents FEM thermal simulation of several possible variants of problem solution and provides results of measurement on physical prototypes with intention to compare. Results shows that the future of cooling in power electronics belongs to printed circuit boards with metal substrate.

PL

Badano chłodzenie układów elektronicznych bazujących na GaN i SiC przy minimalizacji wymiarów i zwiększaniu gęstości mocy. Przedstawiono analizę rozkładu temperatury wybranych układów Najlepsze rezultaty osiągnięto dla obwodów drukowanych z metalowym podłożem.

Słowa kluczowe

EN

power electronics; thermal vias; thermal management; surface mount package cooling; cooling of GaN

PL

układy elektroniczne; chłodzenie; rozkład temperatury

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Przegląd Elektrotechniczny
• Rocznik: 2020
• Tom: R. 96, nr 11
• Strony: 151--154
• Opis fizyczny: Bibliogr. 9 poz., rys.

Twórcy

autor

Šír Michal

• Brno University of Technology, Department of power electrical and electronic engineering, Kolejní 2, 8561 Brno

autor

Feňo Ivan

• Bel power solutions and protection GmbH, Ackerstrasse 29, 8610 Uster

Bibliografia

• [1] D. S. Gautam, F. Musavi, D. Wager, and M. Edington, “A comparison of thermal vias patterns used for thermal management in power converter”, 2013 IEEE Energy Conversion Congress and Exposition, pp. 2214-2218, 2013.
• [2] A. Fodor, R. Jano, G. Chindris, and D. Pitica, “Thermal via placement for high-power applications”, 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME), pp. 223-226, 2017.
• [3] C. Negrea, P. Svasta, G. Chindris, and D. Pitica, “Modeling of thermal via heat transfer performance for power electronics cooling”, 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), pp. 107-110, 2011.
• [4] P. Skarolek, J. Lettl, G. Chindris, and D. Pitica, “GaN Transistors Cooling Options Comparison”, 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), pp. 323-326, 2019.
• [5] J. L. Lu, R. Hou, D. Chen, and D. Pitica, “Opportunities and design considerations of GaN HEMTs in ZVS applications”, 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 880-885, 2018.
• [6] A. P. Catalano, R. Trani, A. Castellazzi, and V. d'Alessandro, “Analytical Modeling of Through-PCB Thermal Vias and Heat-Sinks for Integrated Power Electronics”, in 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2019, pp. 1-6.
• [7] X. Jorda, X. Perpina, M. Vellvehi, J. Millan, and A. Ferriz, “Thermal characterization of Insulated Metal Substrates with a power test chip”, in 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2009, pp. 172-175.
• [8] T. A. Asghari, X. Perpina, M. Vellvehi, J. Millan, and A. Ferriz, “PCB Thermal Via Optimization using Design of Experiments”, in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006, 2006, pp. 224-228.
• [9] J. Nicolics, M. Mundlein, M. Fasching, J. Millan, and A. Ferriz, “Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications”, in 2006 29th International Spring Seminar on Electronics Technology, 2006, pp. 49-54.

Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).