Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

• Autorzy: Guśpiel J. , Wierzbicka-Miernik A. , Reczyński W.

Identyfikatory

DOI

10.1515/amm-2016-0096

• Języki publikacji: EN

Abstrakty

EN

This paper presents the results of the corrosion resistance of Sn-Ag-Cu alloys in air-saturated aqueous solutions containing NO₃^-, SO₄^2- ions, whose concentration was equivalent to their contents in acid rains and in concentrations 10 - 100 times higher. The Ag, Cu and Sn concentrations in the corrosive media were determined using the Atomic Absorption Spectrometry. The specific dissolution rate and corrosion current were derived using the a rotating disc technique. The corrosion rate of Sn- Ag-Cu alloys depends on pH of the examined solutions and on the concentration of oxygen near the phase boundary. In the whole range of concentrations of the applied H₂SO₄ + HNO₃ mixtures of acids, the pure Sn was more corrosion resistant than eutectic alloy as well as the near eutectic one, following the sequence: Sn>Sn3.66Ag0.91Cu>3.8Ag0.7Cu.

Słowa kluczowe

EN

electronic materials; polarization; acid corrosion

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2016
• Tom: Vol. 61, iss. 2A
• Strony: 559--568
• Opis fizyczny: Bibliogr. 16 poz., rys.

Twórcy

autor

Guśpiel J.

• Institute of Metallurgy and Materials Science, Polish Academy of Sciences 25 Reymonta Str., 30-059 Krakow, Poland

autor

Wierzbicka-Miernik A.

• Institute of Metallurgy and Materials Science, Polish Academy of Sciences 25 Reymonta Str., 30-059 Krakow, Poland

autor

Reczyński W.

• AGH University of Science and Technology, Fa culty of Materials Science and Ceramics, Al. Mickiewicza 30., 30-059 Kraków, Poland

Bibliografia

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